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Samsung 3D TSV Stacked DDR4 DRAM
Aug.2015

samsung_ddram_icon_31628436
3 290 €

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Description

Samsung DDRAm FlyerThe First Memory product with Via-Middle TSV!

3D TSV technology is expected to reach $4.8B in revenues by 2019, mainly driven by 3D stacked DRAM and followed by 3D Logic/Memory and Wide I/O according to Yole Développement. With 40% share in the DRAM market, Samsung is by far the number 1 player. By introducing 3D TSV stacking in their latest 64GB DDR4, Samsung allows this technology to enter in the main stream.

This registered dual Inline memory module (RDIMM) includes 36 DDR4 DRAM chips (ref. K4AAG045WD), each of which consists of four 4Gb DDR4 DRAM dies (Ref. K4A4G085WD). The chips are manufactured using Samsung’s 20nm process technology and 3D TSV via-middle package technology.

As a result, the new 64GB TSV module performs twice as fast as a 64GB module that uses wire bonding packaging, while consuming approximately half the power.

Samsung DDRAm img
On the process side, Samsung used a temporary bonding approach using adhesive glue material and copper via-filled using bottom up filling. Also, System Plus paid particular attention in identifying all technical choices made by Samsung on process and equipment (wafer bonding, DRIE via etching, via filling, bumping, underfill…).

The report includes a complete physical analysis and cost estimation of the 3D packaging process, as well as a detailed description of the manufacturing process.

COMPLETE TEARDOWN WITH:

  •  Detailed Photos
  •  Precise Measurements
  •  Material Analysis
  •  Manufacturing Process Flow
  •  Supply Chain Evaluation
  •  Manufacturing Cost Analysis
  •  Selling Price Estimation

Table of contents

Overview / Introduction


Samsung Electronics Company Profile


Physical Analysis

> Physical Analysis Methodology

> Module
  • RDIMM Module Views & Dimensions

> Package
  • View, Dimensions & Marking
  • Package Opening
  • Package PCB Line/Space

> DRAM Die
  • View, Dimensions & Marking
  • Bond Pads & TSVs
  • Die Delayering
  • TSV Details

> Cross-Section
  • Package Cross-Section
  • Micro-bumps Cross-Section
  • TSV Cross-Section
  • Flip-Chip Bumps Cross-Section
 Manufacturing Process Flow

> Global Overview

> TSV & Bumping Process Flow

> Flip-Chip & Stacking Process Flow

> Package Assembly Unit



Cost Analysis

> Main steps of economic analysis

> Yields Hypotheses

> DRAM Front-End Cost

> TSV Manufacturing Cost

> TSV Manufacturing Cost per Process Steps

> Micro-Bumping Manufacturing Cost

> Micro-Bumping Cost per Process Steps

> Flip-Chip Bumping Manufacturing Cost

> Flip-Chip Bumping Cost per Process Steps

> DRAM Die Cost

> Final Packaging Cost

> Final Packaging Cost per Process Steps

> Component Cost

 


SYSTEM PLUS CONSULTING


Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

For more information, please click here.