Discover Samsung’s key devices, advanced packaging technical choices and main suppliers.
Tearing down the Samsung Galaxy S9+, this report focuses in on more than 40 integrated circuits (ICs) from the main boards.
It will help you to identify the manufacturers, the packaging size, type and pitch as well as the function of the main ICs of the S9+. A physical analysis of the main substrates highlights internal structures and technologies used for the printed circuit boards (PCBs).
The report includes teardown photos, detailed package identifications and descriptions, and is accompanied by an Excel file summarizing the S9+ chipset and breaking down the devices by supplier, packages or footprint.
Overview / Introduction
Executive Summary
Physical Analysis
> Views and dimensions of the S9+
> S9+ teardown
> Electronic boards high definition photos
> Main component markings, packaging type, dimensions, pitch, pin count and identification
> PCB surface, cross section and minimum line width
> IC package breakdown
> IC manufacturer design wins
> IC package footprint
ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.
Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.
System Plus Consulting engineers are experts in:
Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.
System Plus Consulting is a sister company of Yole Développement.
More info at www.systemplus.fr
Smartphone teardown
IC identification including markings, manufacturers, references, functions, package types, size and pin count
PCB characteristics, including cross-sections and minimum line width
Breakdown graphs
