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Texas Instruments’ Time of Flight Image Sensor for Industrial Applications

3 490 €

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Texas Instruments OPT82421 Industrial 3D ToF System Plus Consulting Yole Couv Flyer

A look into Texas Instruments’ system-on-chip, including Sony/Softkinetic’s time-of-flight pixel technology, for industrial applications

Today, Time-of-Flight (ToF) systems are among the most innovative technologies offering imaging companies an opportunity to lead the market. Every major player wants to integrate these devices to provide functions such as 3D imaging, proximity sensing, ambient light sensing and gesture recognition.

Sony/Softkinetic has been investigating this technology deeply, providing a unique pixel technology to several image sensor manufacturers in three application areas: consumer, automotive and industrial. For industrial applications, Sony/Softkinetic has licensed its technology to Texas Instruments, which is providing ToF imagers for human detection or robot-human interaction.


Texas Instruments OPT82421 Industrial 3D ToF imager System Plus Consulting


The OPT8241 3D ToF imager is packaged using Chip-On-Glass (COG) technology. The device comprises a system-on-chip (SoC) and glass filter in the same component in thin, 0.7 mm-thick, packaging.


Texas Instruments OPT82421 Industrial 3D ToF System Plus Consulting

This report analyzes the complete component, from the glass near-infrared band-pass filter to the collector based on ToF pixel licenses developed by Sony/Softkinetic and adapted by Texas Instruments. The report includes a complete cost analysis and price estimation of the device based on a detailed description of the package, and the ToF imager.


Texas Instruments OPT82421 Industrial 3D ToF imager System Plus Consulting 2


It also features a complete ToF pixel technology comparison with the Infineon/pmd, STMicroelectronics and Melexis automotive ToF imagers, which are all also based on Sony/Softkinetic technology, with details on the companies’ design choices.



Table of contents

Overview / Introduction


Texas Instruments Company Profile and Time of Flight Technology


Physical Analysis

> Physical Analysis Methodology
> Package
- View and dimensions
- Package opening 
- Package cross-section: optical filter, RDL, bumps

> Image Die 
- View, dimensions and marking
- Die overview: active area, CPAD technology
- Die delayering, main block ID and process
- Cross-section: metal layers, pixel
- Process characteristics




ToF Pixel Physical Comparison with Infineon, STMicroelectronics, Melexis Automotive ToF Image Sensor

> Package, Pixels, Filters













































Manufacturing Process Flow 

> Overview
> ToF Imager Front-End Process
> ToF Imager Wafer Fabrication Unit
> Packaging Process Flow
> Final Assembly Unit


Cost Analysis

> Cost Analysis Overview
> The Main Steps Used in the Economic Analysis
> Yield Hypotheses
> ToF Imager Die Cost
- Front-end cost
- Back-end: tests and dicing
- Wafer and die cost

> Component
- Packaging cost
- Packaging cost by process step
- Component cost



Estimated Price Analysis

About the authors


System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

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  • Detailed photos

  • Precise measurements

  • Material analysis
  • Manufacturing process flow

  • Supply chain evaluation

  • Manufacturing cost analysis

  • Estimated sales price

  • ToF pixel comparison with Infineon, STMicroelectronics, and the Melexis MLX75023