With Apple and TSMC changing the game, 2016 is a turning point for the Fan-Out market. The number of enforceable patents is increasing worldwide, with several companies already standing out by virtue of their strong IP position.
Comparison of main players AP: Apple A10 with inFO vs. Qualcomm Snapdragon 820 with MCeP packaging technology vs. HiSilicon Kirin 955 & Samsung Exynos 8 with standard Package-on-Package
The first ultra-small multi-die low power module with boot memory and power management integrated in a package-on-package compatible device for the Internet of Things
Reverse engineering and costing of the new Integrated Passive Device technology from TSMC used for Apple’s latest A10 application processor, found in the iPhone 7
Comparison of both Samsung Galaxy S7 processor packages: Qualcomm Snapdragon 820 MSM8996 with MCeP packaging technology vs. Samsung Exynos 8 with TMV Package-on-Package