Advanced Packaging & System Integration Technology Symposium – 2018

NCAP China, part of JITRI, and Yole Développement (Yole) organized the 4th Advanced Packaging & System Integration Technology Symposium. The 2018 edition took place in Wuxi, China, on June 20 & 21. It was a 2-day conference to answer strategic questions and get the opportunity to meet the leaders in the advanced packaging industry. After the last four successful events, Yole Développement & NCAP have decided to continue and strengthen their collaboration to once again provide a powerful program including Panel Level, FO, SiP, advanced substrates, 3D technology. Megatrends has been at the heart of the conference hosted by NCAP CHINA. Advanced packaging is always on the move.

Megatrend will probably be the key word for the next 10-years within the advanced packaging industry, and more generally in the semiconductor industry, AI , IoT , 5G, mobility, and more… all major applications of our century are today the new drivers of these industries

Emilie Jolivet

Semiconductor & Software Division Director

First held in 2014, the Advanced Packaging & System Integration Technology Symposium attracts more than 180 worldwide executive attendees each year. The program, designed by both partners Yole and NCAP China, have brought together numerous valuable discussions, short courses, meetings and business collaborations. The list of executive speakers was impressive! The 2018 program welcomed two keynotes, among the numerous presentations:

  • Impact of the industry trends on advanced packaging – Jean-Christophe Eloy, President, Yole Group of Companies. Yole Group of Companies includes Yole Développement, System Plus Consulting, KnowMade and PISEO.
  • The industrialization road of innovative Wafer Level Fan-Out technology: eSiFO – Dr. Daquan Yu, VP, Huatian Technology Electronic

… And much more.

Amongst the numerous sessions of the Advanced Packaging & System Integration Technology, 2018 edition, FOWLP has been deeply covered by a significant list of speakers: Klemens Reitinger, CEO, ERS electronic, Stephen Hiebert, Sr Director of Marketing, KLA-Tencor and David Butler, EVP General Manager, SPTS Technologies.

Enjoy the picture of the event here!

Yole Développement’s 2019 calendar will be available soon. Make sure to be aware of the conferences that will be organized next year. Stay tuned!

Feel free to come back to us with any questions!

Contact: Fanny (vitrey@yole.fr)

Source: www.yole.fr

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