Advanced Packaging & System Integration Technology Symposium – 2019

Encouraged by four consecutive years of successful symposiums, which attracted more than 135 participants last April, Yole Développement was proud to collaborate with NCAP (National Center for Advanced Packaging) this year again, to organize the Advanced Packaging & System Integration Technology Symposium in Shanghai. The symposium offered a unique place in the world where leading companies could share their vision of the advanced packaging industry, evaluate the emerging platforms, and identify business opportunities.

Advanced packaging has entered its most successful era boosted by need for better integration, the end of Moore’s law and, beyond that, the megatrends, transportation, 5G, consumer, memory & computing, AI & HPC. With 25 inspiring presentations, 2 market briefings and several networking times to cover a broad range of topics, the symposium provided a powerful program directly related to the impact of megatrends on the advanced packaging industry.

Yole Group of Companies’ experts, Emilie Jolivet – Division Director, Favier Shoo – Technology & Market Analyst and Santosh Kumar – Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea, as well as Thibault Buisson, Chief Operating Officer and Romain Fraux – System Plus Consulting CEO invite you today to discover their presentations:

Market Briefing: AI, HPC and Memory – Yole Développement

Market Briefing: Advanced Packaging Trends in this Era of Digital New Age – Yole Développement

Trends in Automotive SiP Systems – Transportation Session – System Plus Consulting

Advanced RF Packaging Technology Trends, on the way to 5G and mmWave Applications – 5G Session – System Plus Consulting

Feel free to come back to us with any questions!

The presentations below are only available for the attendees of the event. Thank you for your understanding.

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