Advanced substrates: the wind of change

Historically, the IC substrate and board industry has assumed a passive role, especially when it comes to innovation. However, in the past few years, things have changed. The dedicated landscape welcomed innovative solutions and new players.

“Today, we are facing an increasingly competitive ecosystem and players are looking to differentiate from each other’s” asserts Mario Ibrahim, Technology & Market Analyst at Yole Développement (Yole).“As the mobile segment matures with saturating growth, the value creation efforts are shifting towards emerging products, especially in Telecom & infrastructure (datacenters, 5G) and automotive.”

Courtesy of Yole Développement

Substrate & PCB global market will record a modest CAGR of around 4% between 2018 and 2024. But, if we only consider advanced substrate technologies as SLP and ED technology for example, the market exhibits a much higher growth rate, up to 49% CAGR for ED over the same period…

These figures are part of the new technology & market report, “Status of advanced substrates” published by Yole. Under this dynamic context, this report points out the actual trends and their impact on the substrate manufacturing. This new edition is analyzing FC BGA and FS CSP substrate capacity. It also includes new SLP applications and highlights the latest adoption of embedded die package. Two other trends are also analyzed in this report: substrate manufacturers are today switching to mSAP and the Chinese industry is also consolidating its substrate manufacturing ecosystem…

Yole Développement and System Plus Consulting, both parts of Yole Group of Companies announce a dedicated online event on July 2. Titled, The Sleeping Substrate Giants are Awakening, Mario Ibrahim from Yole and Stéphane Elisabeth, Expert Cost Analyst, RF, Sensors & Adv. Packaging, System Plus Consulting, propose this engaged webcast to present their vision, from technology to market, on the past, present, and future of advanced substrates. The advanced substrate industry has started to innovate to keep up with advanced packaging trends. Make sure to get a deep understanding of the market drivers and key challenges and register today!

Mega trends are pushing the packaging technologies to the extreme in order to answer their stringent requirements with smaller footprint, higher performances and lower power consumption. Substrate makers are working since few years to improve their technology portfolio and innovate in order to follow these trends… Full article

Source: www.yole.fr, www.systemplus.fr

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