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NCAP Yole Symposium 2016

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information in Chinese  
Discover the complete agenda with abstract and speakers bio here
 

Thursday 21st of April 


8:30 AM: Welcome and networking
Wenqi Zhang, R&D Director, National Center for Advanced Packaging (NCAP)and Thibaut Buisson, Advanced Packaging Business Unit Manager, Yole Développement

 

09:00 AM:  New Requirements for Advanced Packaging Equipment
Ruurd Boomsma, CTO, Besi

09:45 AM: Session 1: Interposer and 3D Integration Technologies


3D TSV & 2.5D Interconnect for Advanced Packaging Technologies & Market Trends
Santosh Kumar, Technology and Market Analyst, Yole Développement

 

Pathfinding and Co-Design Methodology for Fan-Out and 2.5D/3D Integration 
Farhang Yazdani,  President & CEO, BroadPak Corporation

 

TSV platform for 2.5D system integration and 3D WLP
Wenqi Zhang, R&D Director, National Center for Advanced Packaging (NCAP)

11:00 AM -  Coffee break & networking

 

11:30 AM: Session 2: Advanced Wafer Level Packaging Technologies

 

Advanced WLP technologies including the progress on new fan out technology in Huatian
Daquan Yu, Vice President, Huatian Technology

 

Advanced 2.5D/3D eWLB/FO-WLP Technology 
Yoon Seung Wook, Director Products & Technology Marketing, STATS ChipPAC, JCET Group

 

Title TBD
JCAP

 

12:45 AM - Lunch & networking

 

2:00 PM: Session 3: Key Manufacturing Processes for Advanced Packaging

 

Title TBD
Thomas Uhrmann, Head of Business Development, EV Group

 

FOWLP – Novel PVD technology enables the fastest growing package platform
David Butler, Vice President Marketing, SPTS Orbotech

 

Advanced Flip-Chip Interconnect Technology
Li Ming, R&D Director, ASM Pacific technology


3:15 PM – Coffee break & networking

 

3:45 PM: Session 4: Module and System Integration

 

Title TBD
Nepes

 

Title TBD
ASTRI

 

Thoughts on System Integration through Collaborative Wafer Fabrication and Advanced Packaging Technology Solutions
Herb He Huang, Ph.D., Sr. Director, 3DIC and Sensors Technology Development, Corporate R&D Center, Semiconductor Manufacturing International Corporation (SMIC)

 

5:00 PM – Coffee break & networking


5:30 PM: Panel discussion: Is the Supply Chain ready to support the latest advancements in Packaging?


Moderator: Yole Développement
Participants : TBD

 

6:30 PM – 7:30 PM – Networking cocktail

 


Friday 22nd of April 

8:15 AM: Welcome

 

8:30 AM: Keynote - Huawei

 

9:15 AM: Session 5: MEMS & Sensors   

Internet of Things (IoT) Connected to Automotive System

Dr. Larry Hsiao, Assistant Manager, MEMS & Photonics Engineering, ASE Group  

 

TBD 
Steve Lerner, CEO, Alpha Szenszor

 

MIS platform development 
Steve Liang, VP, JCET Jiangsu Changjiang Electronics Technology Co. Ltd (JCET)

 

10:30 AM: Coffee break & networking

 

11:00 AM: Session 6: Equipment for Advanced Packaging

Title TBD
Mohamed Elghazzali, Evatec 

Integration of Plasma Dicing for Advanced Packaging and Emerging Devices 
David Lishan, Principal Scientist, Plasma-Therm

Optical Metrology and Inspection for Fan-Out Wafer Level Packaging

Jim Xu, CTO, Zeta Instruments


12:15 AM – Lunch

 

1:00 AM: Session 7: Equipment and Material for Advanced Processes

Title TBD
Mr. Alvin Lee, Deputy Director, Asia region, Brewer Sciences

 

SCHOTT ultrathin glass and its application in AP
Feng He, Senior Application Manager, SCHOTT 

 

Wet Process Technology of Advanced Package
Wang Su, CTO, Shanghai Sinyang Semiconductor Materials


2:15 PM Closing session


From 2:30 PM to 5:00 PM – NCAP Tour


On the afternoon, and on a volunteer basis, NCAP will invite the participants to visit its facilites. Program includes NCAP Introduction, Material Consortium Plan Introduction, Lab Tour

 

 Discover the complete agenda with abstract and speakers bio here

 

 

More information or any question, please contact Clotilde (This email address is being protected from spambots. You need JavaScript enabled to view it.).  

 

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Sponsored by  

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