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Thermal Management in Smartphones: Technology Comparison 2017
Dec.2017

thermal_management_smartphone_technology_overview_system_plus_v3
3 490 €

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Description

Thermal management smartphone technology couv flyerComparative analysis of thermal management solution analysis of 10 flagship smartphones from Apple, Samsung, Huawei, LG and Xiaomi

A smartphone contains several components that generate heat and other components sensitive to heat; to maintain acceptable temperature levels in these small handheld devices, manufacturers propose different solutions which require high performance and design constraints.
To complement Yole Développement’s Market Opportunities for Thermal Management Components in Smartphones report, System Plus Consulting has conducted a comparative technology review to provide insights into the assembling structure and thermal management technology of 10 flagship smartphones from leading suppliers: Apple, Samsung, Huawei, LG and Xiaomi.
In this report, we highlight the differences and the innovations in the thermal management solutions chosen by the end-user OEMs.


Whereas some OEMs use standard solutions such as heat spreaders of metal frames, others choose to consider more complex structures such as heat pipes.

 

Thermal management smartphone technology overview System Plus v1

 

Moreover, as the processor is one of the most important heat sources, we have seen how the PCB design has changed to improve thermal dissipation and how the packaging of the processor itself has evolved to solve thermal problems caused by miniaturization and efficiency increase. Located close to the battery and the DRAM chip on the main board, the application processors are packaged using different Package-on-Package (PoP) technologies. Some AP providers, like HiSilicon or Samsung, use conventional PoP with embedded land-side capacitors; others, like Apple or Qualcomm, use innovative technologies like fan-out PoP or embedded die packaging with advanced PCB substrate.
This report includes multiple comparisons based on physical analyses of the latest flagship smartphones. It offers the unique possibility of seeing thermal management technology evolution, tracked by manufacturer.

 

 

 

 

 

 

 

 

Table of contents

Overview / Introduction


 

Company Profile


> Apple, Samsung, Huawei, Xiaomi, LG
> Smartphone History

 

Thermal Management Solutions and Comparison


> Heating Zones
> Processor Design and Packaging
> Telephone Assembly Thermal Solutions

 

Physical Analysis


Physical Analysis Methodology 

> Apple
- iPhone 6s Plus: Package view and heating zones, board PCB and heat spreader, processor A9
- iPhone 7 Plus: Package view and heating zones, board PCB and heat spreader, processor A10
- iPhone 8: Package view and heating zones, board PCB and heat spreader, processor A11
- iPhone X: Package view and heating zones, board PCB and heat spreader, PCB integration






 

 

 

 

 

 

 

 

 

 

 

 

 

> Samsung
- Galaxy S7: Package view and heating zones, board PCB and heat spreader, processor Snapdragon 820 and Exynos 8, heat pipes
- Galaxy S8: Package view and heating zones, board PCB and heat spreader, Qualcomm Snapdragon 835, heat pipes

> Huawei
- P9: Package view and heating zones, board PCB and heat spreader, processor Kirin 955
- Mate 9 Pro: Package view and heating zones, board PCB and heat spreader

> LG
- G6: Package view and heating zones, board PCB and heat spreader, heat pipes

> Xiaomi
- Mi5: Package view and heating zones, board PCB and heat spreader



 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

  

 

 

 

 

 

 

 

 

 

 


About the authors

ABOUT SYSTEM PLUS CONSULTING

System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

More info at www.systemplus.fr 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

REVERSE COSTING WITH

  • Detailed photos

  • Precise measurements

  • Internal packaging structures

  • Thermal management solutions

  • PCB package cross-sections

  • Processor package analysis