Bosch attempts to penetrate the forward camera market with a distinctive architecture and cost effective solution
Bosch’s second-generation multi-purpose camera (MPC2) offers manufacturers a scalable, monocular camera platform for video-based driver assistance systems. The MPC2 allows vehicle manufacturers to integrate a wide range of driver assistance functions into their vehicles using only a single sensor.
The MPC2 imager module comprises the system optics and includes a highly dynamic complementary metal oxide semiconductor (CMOS) colour imager with a resolution of 1,280 x 960 pixels. Thanks to its improved resolution, the new imager allows for a larger opening angle than its predecessor, and a significantly increased object detection range, now extending to over 120 meters.
The MPC2 is based on a dual microcontroller unit ARM processor design. Its custom algorithm allows the optical system’s packaging to be simpler and cheaper than other products in its category.
This variant of the multi-purpose camera allows manufacturers to integrate a wide range of functions targeting the Advanced Driver Assistance System market.
Based on a teardown of the system, this report details a complete bill of material, and the camera’s manufacturing and packaging processes. Electronics, housing and imaging are presented in the report as well as the physical analysis of the CMOS Imaging System. An estimation of the manufacturing cost and selling price is included.
This report is best when used to compare design architectures and price analyses of the other main players’ cameras, such as Continental’s MFC430TA and TRW’s SCam-3. In fact, a complementary comparative analysis of the three cameras will be provided to everyone who buys our three reports in a bundle.
Overview / Introduction
> Executive summary > Reverse costing methodology
> Views and Dimensions of the System> System Opening> Electronic Board- Top side – overview- Top side – high definition photo - Top side – PCB markings- Top side – main component markings- Top side – main component identification- Top side – other component markings- Top side – other component identification- Bottom side – high definition photo- Bottom side – component identification> CMOS Image Sensor
> Accessing the BOM> PCB Cost> CIS Cost > BOM Cost – Electronic Board> Housing Parts – Estimation> BOM Cost – System Housing> Material Cost Breakdown by Sub-Assembly> Material Cost Breakdown by Component Category> Accessing the Added Value (AV) cost> Electronic Board Manufacturing Flow> Details of the Electronic Board AV Cost> Details of the System Assembly AV Cost> Added-Value Cost Breakdown> Manufacturing Cost Breakdown
Estimated Price Analysis
> Estimation of the Manufacturing Price
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Complete bill of material
Image sensor detailed analysis
Manufacturing process flow
Supply chain evaluation
Manufacturing cost analysis in two countries
Selling price estimation for two annual volumes in each location