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BOSCH Sensortec BMF055 Cortex M0+ 9-Axis Sensor Hub in SiP
Apr.2016

bosch_bmf055_package_opening_mems_gyro_acc_6-axis_system_plus_consulting
3 490 €

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Description

Bosch BMF055 flyer

Industry’s first Custom-Programmable System-in-Package 9-Axis Motion Sensor

Like its competitor InvenSense, BOSCH Sensortec has unveiled a programmable all-in-one motion sensor for robotics, gaming, and household IoT devices, touted as the industry’s first custom-programmable 9-axis motion sensor.  

The BMF055 is a new version of the BOSCH Sensortec 9-axis device (3-axis Gyroscope + 3-axis Accelerometer + 3-axis Magnetometer), with a MCU included in the package. Compared to the stand-alone sensor hub, this new approach eliminates a package and reduces system-level power. This device integrates six-chip in a complex System-in-Package.

Bosch BMF055 MEMS gyro Acc 6 axis system plus consulting

The sensor hub combines a 14-bit accelerometer, a 16-bit gyroscope, and a geomagnetic sensor with a 32-bit ARM Cortex M0+ core. Compared to rivals, BOSCH Sensortec targets a broader range of customer applications with a high precision-sensor and dedicated MCU. 

With BOSCH Sensortec’s approach, the MEMS sensor and the ASIC are fabricated separately. Final assembly entails wire bonding of all parts. The BMF055 is shipped in a 5.8x3.2x1.15mm LGA package, a footprint that’s larger than the competition.

Bosch BMF055 Package opening MEMS gyro Acc 6 axis system plus consulting

This report features a detailed technology and cost comparison with the leading-edge sensor hub from InvenSense, highlighting the different choices from the two different designers.

 

Bosch BMF055 Electrode SEM view MEMS gyro Acc 6 axis system plus consulting

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Table of contents

Overview / Introduction


 

Bosch Company profile


 

Physical Analysis


> Physical analysis
- Physical analysis methodology
> Package
- Package characteristics: view, dimensions, and opening
- Package cross-section
> ASIC Dies
- View, dimensions, and markings
- Delayering and main blocks ID
- Cross-section
- Process characteristics
> MEMS Dies
- View, dimensions, and markings
- Bond pad opening and bond pad
- MEMS cap removed and details
- Sensing area details
- MEMS cross-section
- MEMS process characteristics
> MCU Die
- View, dimensions, and markings
- Delayering and main blocks ID
- Process and die cross-section
- Die process characteristics
> Magnetometer Die
- View, dimensions, and markings
- Hall sensor and fluxgate sensor
- Delayering and main blocks ID
- Process and die cross-section
- Die process characteristics

 

  

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Manufacturing Process Flow


- Global overview
- ASIC front-end process
- MEMS process flow
- Magnetometer process flow
- ASIC, MEMS, and MCU wafer fabrication unit
- Packaging process flow and assembly unit

 

Cost Analysis


- Main steps of economic analysis
- Yields hypotheses
- ASIC & MCU front-end cost
- ASIC & MCU back-end 0: probe test and dicing
- ASIC & MCU wafer & die cost
- MEMS front-end cost
- MEMS front-end cost per process steps
- MEMS back-end 0: probe test and dicing
- MEMS wafer and die cost
- Magnetometer CMOS front-end cost
- Magnetometer sensor cost
- Magnetometer sensor cost per process steps
- Magnetometer back-end 0: probe test and dicing
- Magnetometer wafer and die cost
- Back-end: packaging cost
- Back-end: packaging cost per process steps
- Back-end: final test cost
- Component cost and price

                                              

Cost & price comparison with InvenSense ICM-30630 6-Axis Sensor Hub


 

 


About the authors



ABOUT SYSTEM PLUS CONSULTING

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses.

The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling. We offer:custom reverse costing analyses, standard reverse costing reports and costing tools within the following fields: integrated circuits, power devices and modules, MEMS & sensors, photonics (LED, Image Sensors), packaging and electronic boards and systems. www.systemplus.fr.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

REVERSE COSTING WITH

  • Detailed Photos

  • Precise Measurements

  • Material Analysis

  • Manufacturing Process Flow

  • Supply Chain Evaluation

  • Manufacturing Cost Analysis

  • Estimated Sales Price

  • Comparison with InvenSenseICM-30630 6-Axis Sensor Hub and previous generation of 9-Axis IMU