Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

 ASK A QUESTION

Bosch SMI130 6-Axis Automotive MEMS IMU
Apr.2015

yole bosch smi130 icon
2 990 €

Choose a minimum of three reports from Yole Group and receive a discount of at least 39% on your package – Contact us!
+



Description

Yole Bosch SMI130 flyerBosch’s first 6-Axis IMU for Automotive Application combining 3-Axis Gyroscope and 3-Axis Accelerometer

MEMS are getting broadly adopted in the automotive industry and non-safety applications like in-dash navigation are now requiring low-cost and small footprint components.

The SMI130 combines a 12-bit 3-Axis accelerometer and a 16-bit 3-Axis gyroscope in a 4.5x3.0mm LGA packages which is AEC-Q100 qualified for automotive applications. The measurement range of the yaw rate sensor can be adjusted in up to five steps between ±125°/s and ±2000°/s; the acceleration sensor offers four different measurement ranges between ±2g and ±16g.

The gyro integrates a new process for the capping. Indeed, the classic "glass-frit" wafer bonding has been abandoned in favor of an eutectic Aluminum-Germanium bonding.

The accelerometer features a new design which uses now only one mass structure for the moving parts compared to three for the previous generations.

The SMI130 is designed for non-safety-critical applications in the automotive industry, including in-dash navigation and telematics systems such as toll, eCall, and alarm systems.
Yole Bosch SMI130 img
COMPLETE TEARDOWN WITH:

  • Detailed Photos
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • Supply Chain Evaluation
  • Manufacturing Cost Analysis
  • Selling Price Estimation
 

Table of contents

Glossary

Overview/Introduction , Bosch Company Profile
> Physical Analysis
  • Package
  • Package Views & Dimensions
  • Package Opening
  • Wire bonding Process
  • Package Cross-Section
> ASIC Gyro & Accelero Dies
  • View, Dimensions & Marking
  • Delayering
  • Main Blocks Identification
  • Cross-Section
> MEMS Gyro & Accelero Dies
  • View, Dimensions & Marking
  • Bond Pad Opening & Bond Pad
  • Cap Removed & Cap Details
  • Sensing Area Details
  • Cross-Section (Sensor, Cap & Bonding)
  • Process Characteristics
Manufacturing Process Flow

> ASIC Gyro & Accelero Front-End Process
> MEMS Gyro & Accelero Process Flow
> Wafer Fabrication Unit
> Packaging Process Flow & Assembly Unit


Cost Analysis

> Yields Hypotheses
> ASICs Front-End Cost
> ASICs Wafer & Die Cost
> MEMS Gyro & Accelero Front-End Cost
> MEMS Gyro & Accelero Front-End Cost per process steps
> MEMS Gyro & Accelero Wafer & Die Cost
> Back-End : Packaging Cost
> Back-End : Packaging Cost per Process Steps
> Back-End : Final Test & Calibration Cost
> SMI130 Component Cost


Estimated Price Analysis

> Bosch Financial Ratios
> Component Price

SYSTEM PLUS CONSULTING

Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

For more information, please click here.