A compact, cost-effective and high-performance Advanced Driving Assistance System (ADAS)
Delphi is the first to provide a single system combining 76Ghz Radar and Vision Sensing. With a compact design the system can be integrated behind the windshield and enables a broad array of active safety features, as lane tracking, collision avoidance or adaptive cruise control.
The visual detection is performed by a 1/3” CMOS Image Sensor supplied by a leader in the CIS automotive industry. The sensor is surmounted by a specific 7-lens module and the Mobileye EyeQ3 SoC is used for video processing. Concerning the radar function, Receiver and Transmitter chips from Infineon using SiGe HBT technology are assembled by wire bonding on the RF Board. The Antenna board uses a PTFE-based substrate and is equipped with planar antennas for transmission and reception of the RF signals.
Based on a complete teardown analysis of the Delphi RACam, the report provides the bill-of-material (BOM) and the manufacturing cost of the system. The report also includes analysis of the Image Sensor and Lens module. A structural analysis, with a comparison with Bosch MRR1, highlights the technical choices in RF design made by Delphi.
A physical analysis and manufacturing cost estimation of the Infineon RF chips is available in a separate report, which also includes a comparison with MMICs used in the Bosch MRR1 Radar.
Overview / Introduction
> Global View of the Radar> Views and Dimensions of the Radar> Radar Disassembly> Camera Module Disassembly> Lens Module> Electronic Boards - MCU Board - RF Board - Camera Module Board - Waveguide Board - Antenna Board> RF Design> Cross Section and EDX Analysis> RRN7740 and RTN7750 - Views and Dimensions - Detail Functions> Mobileye EyeQ3 - Views and Dimensions - Openning
> Estimation of the cost of the PCBs> Estimation of the Cost of the MCU> Estimation of the Cost of the CMOS Image Sensor> BOM Cost - MCU Board> BOM Cost - RF Board> BOM Cost - Camera Module> BOM Cost - Housing> Material Cost Breakdown> Accessing the Added Value (AV) cost> MCU Board Manufacturing Flow> RF Board Manufacturing Flow> Details of the Housing Assembly & Functional Test Costs> Added Value Cost Breakdown> Manufacturing Cost Breakdown
Estimated Price Analysis
- Estimation of the Manufacturing Price
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Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling. We offer:custom reverse costing analyses, standard reverse costing reports and costing tools within the following fields: integrated circuits, power devices and modules, MEMS & sensors, photonics (LED, Image Sensors), packaging and electronic boards and systems. www.systemplus.fr.
Lens-module Cross Section and EDX
CIS Analysis and Cost estimation
MCU cost estimation
RF Design structural Analysis
Comparison with Bosch MRR1
Bill of Material
Manufacturing Process Flow
Manufacturing Cost Analysis
Manufacturing Price Estimation