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Delphi RACam Integrated Radar and Camera

3 490 €

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delphi flyer

A compact, cost-effective and high-performance Advanced Driving Assistance System (ADAS)

Delphi is the first to provide a single system combining 76Ghz Radar and Vision Sensing. With a compact design the system can be integrated behind the windshield and enables a broad array of active safety features, as lane tracking, collision avoidance or adaptive cruise control.

The visual detection is performed by a 1/3” CMOS Image Sensor supplied by a leader in the CIS automotive industry. The sensor is surmounted by a specific 7-lens module and the Mobileye EyeQ3 SoC is used for video processing. Concerning the radar function, Receiver and Transmitter chips from Infineon using SiGe HBT technology are assembled by wire bonding on the RF Board. The Antenna board uses a PTFE-based substrate and is equipped with planar antennas for transmission and reception of the RF signals.

Based on a complete teardown analysis of the Delphi RACam, the report provides the bill-of-material (BOM) and the manufacturing cost of the system. The report also includes analysis of the Image Sensor and Lens module. A structural analysis, with a comparison with Bosch MRR1, highlights the technical choices in RF design made by Delphi.

A physical analysis and manufacturing cost estimation of the Infineon RF chips is available in a separate report, which also includes a comparison with MMICs used in the Bosch MRR1 Radar.

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Table of contents

Overview / Introduction


Company profile


Physical Analysis

> Global View of the Radar
Views and Dimensions of the Radar
Radar Disassembly
Camera Module Disassembly
Lens Module
Electronic Boards
     - MCU Board
     - RF Board
     - Camera Module Board
     - Waveguide Board
     - Antenna Board
RF Design
Cross Section and EDX Analysis
RRN7740 and RTN7750
      - Views and Dimensions
      - Detail Functions
Mobileye EyeQ3
      - Views and Dimensions
      - Openning




































Cost Analysis

> Estimation of the cost of the PCBs
Estimation of the Cost of the MCU
Estimation of the Cost of the CMOS Image Sensor
BOM Cost - MCU Board
BOM Cost - RF Board
BOM Cost - Camera Module
BOM Cost - Housing
Material Cost Breakdown
Accessing the Added Value (AV) cost
MCU Board Manufacturing Flow
RF Board Manufacturing Flow
Details of the Housing Assembly & Functional Test Costs
Added Value Cost Breakdown
Manufacturing Cost Breakdown


Estimated Price Analysis

      - Estimation of the Manufacturing Price


About the authors


Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses.

The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling. We offer:custom reverse costing analyses, standard reverse costing reports and costing tools within the following fields: integrated circuits, power devices and modules, MEMS & sensors, photonics (LED, Image Sensors), packaging and electronic boards and systems.

























































  • Detailed Photos

  • Precise Measurements

  • PCBs Cross Section and EDX
  • Lens-module Cross Section and EDX

  • CIS Analysis and Cost estimation

  • MCU cost estimation

  • RF Design structural Analysis

  • Comparison with Bosch MRR1

  • Bill of Material

  • Manufacturing Process Flow

  • Manufacturing Cost Analysis

  • Manufacturing Price Estimation