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EgisTec ET300 - Fingerprint Sensor
Feb.2016

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2 990 €

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Description

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Philips integrates in its smartphone the innovative fingerprint sensor developed by EgisTec

After a first introduction in the Aurora i966, EgisTec integrates again its fingerprint ET300 in the Philips i999, a smartphone for the Chinese market.
With very simple technical choices concerning the technical detection design and the packaging, EgisTec offers a very competitive sensor in terms of size and manufacturing cost.

Located on the back side of the smartphone, the fingerprint sensor of the Philips i999 has dimensions of 11.6 x 11.6. It is assembled on a square LGA packaging and is protected by metal support.

The sensor has a resolution of 17,920 pixels with a pixel density of 500ppi. It uses a capacitive touch technology to take an image of the fingerprint from the subepidermal layers of the skin.
The sensor die is manufactured with CMOS 0.15µm technology and it is connected by mean of wire bonding to the rigid PCB.


Thanks to its design and manufacturing process, EgisTec device is very smart and cost effective in respect to the competitors.


The report includes comparisons with the latest Huawei’s, Samsung’s and Apple’s fingerprints buttons.

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Table of contents

Overview / Introduction


 

Company profile & Supply Chain


 

Physical Analysis


> Physical Analysis Methodology
> Fingerprint Button Disassembly
  - Fingerprint sensor Removal
  - Fingerprint sensor assembly view

 

Fingerprint sensor assembly
  - Fingerprint sensor Views
  - Fingerprint sensor Cross-Section

 

> Sensor Die

  - View, Dimensions & Marking
  - Sensor Die Capacitors
  - Sensor Die Edge Contact
  - Sensor Die Delayering & main Blocs
  -  Sensor Die Process
  - Process & Cross-Section
  - Sensor Die Process Characteristic

  

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Manufacturing Process Flow


> Sensor Die Front-End Process
> LGA Packaging Process
> Sensor Die Front-End Process
> Final Test & Packaging
> Fabrication unit
> Synthesis of the main parts

 

Cost Analysis


> Sensor Die Front-End Cost, Probe Test, Thinning & Dicing
> LGA Packaging Cost
> Sensor component cost
>ASIC Die Front-End Cost, Probe Test, Thinning & Dicing
> ASIC die cost
>Assembled Components Cost
> Synthesis of the assembling
> Fingerprint Component Cost

                                           

Technology and Cost comparison with Huawei, Apple and Samsung fingerprint sensors


 

 


About the authors



ABOUT SYSTEM PLUS CONSULTING

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses.

The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling. We offer:custom reverse costing analyses, standard reverse costing reports and costing tools within the following fields: integrated circuits, power devices and modules, MEMS & sensors, photonics (LED, Image Sensors), packaging and electronic boards and systems. www.systemplus.fr.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

REVERSE COSTING WITH

  • Detailed Photos

  • Precise Measurements

  • Material Analysis

  • Manufacturing Process Flow

  • Supply Chain Evaluation

  • Manufacturing Cost Analysis

  • Selling Price Estimation

  • Comparison with Huawei, Apple and Samsung fingerprint sensors