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Enphase S280 Microinverter

2 990 €

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Yole Enphase S280 Microinverter IconeBest in class SmartGrid-ready 280VA inverter with new generation ASIC-based topology for lighter design and enhanced solar power management

In a continuously expanding market, with a forecast compound annual growth rate of 5.9% through to 2021, Enphase Energy remains the world’s leading solar microinverter company.  It has shipped more than 11 million units to date, with 460,000 residential and commercial photovoltaic installations worldwide.

Designed for high-powered, 60-cell modules, the advanced grid-ready Enphase S280 Microinverter achieves the highest efficiency for module-level power electronics and reduces the cost per watt. With its all-AC approach, the S280 simplifies design and installation for 280VA installations, and delivers optimal energy harvest. The S280 is compatible with storage systems, including battery management systems.

This inverter is the result of Enphase’s desire to enhance integration with a new generation of dedicated application specific integrated circuit (ASIC) in its topology. This approach reduces the size and number of components and improves reliability, safety and functionality.

Based on a complete teardown analysis of the Enphase S280, this report provides the system’s complete bill of materials (BOM) and manufacturing cost. Physical and cost analysis of the microinverter ASIC is also included in the report.

A comparison with Enphase’s previous microinverters is provided, highlighting the improvement made at the hardware level resulting in a shorter bill of material and significant cost reduction.


 Enphase S280 Microinverter ASICEnphase S280 Microinverter electronic board System Plus consulting












Table of contents

Overview / Introduction

> Executive Summary
> Reverse Costing Methodology


Company Profile

> Enphase
> S280 Features


Physical Analysis

> Views and Dimensions of the Inverter
> Inverter Opening
> Cable Support
> Connectors of the Inverter
> Electronic Board
Top side – overview
Top side – high definition photo
Top side – P.C.B. markings
Top side – main component markings
Top side – main component identification
Top side – discrete component markings
Top side – discrete component identification
Top side – magnetic component identification
Top side – protection component identification
































Bottom side – high definition photo
Bottom side – component identification
Potting compound analysis


Cost Analysis

> Investigating the BOM
> Estimation of the Cost of the PCB
> Estimation of the Cost of the Enphase MB8AC3100 ASIC
> BOM Cost – Electronic Board
> Estimation of the Cost of the Housing Parts
> BOM Housing
> Material Cost Breakdown
> Investigating the Added Value (AV) Cost
> Electronic Board Manufacturing Flow
> Details of the Electronic Board AV Cost
> Details of the System Assembly AV Cost
> Added Value Cost Breakdown
> Manufacturing Cost Breakdown


Overview / Introduction

> Estimated Price Analysis
> Estimation of the Manufacturing Price
> Estimation of the Selling Price
> Functional Cost Breakdown


About the authors


System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.


Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.


System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.


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  • Detailed photos

  • Materials analysis

  • PCB cross-section

  • Potting EDX analysis

  • ASIC physical analysis and cost estimate

  • Complete and priced bill-of-materials

  • Manufacturing process flow

  • Manufacturing cost analysis

  • Estimated cost and sales price