A small, easy to use, low-power, cheap non-contact temperature measurement for varying applications.
LWIR imaging is increasingly used in myriad applications, from consumer to industrial. Low-cost, large arrays (32 x 32 and more) are specifically adapted to smart home/smart building applications for occupant detection, popu-lation localization, population counting, fire detection, and more. For these large markets of many hundreds of millions units a year, thermopile sensors are cost-competitive compared to micro-bolometers.
Based on a low-definition, 32 x 32 thermopile sensor, Heimann Sensor’s HTPA32x32d is dedicated to these markets. Cheaper than a microbolometer and easier to integrate, the thermopile offers very good performance for applications that do not require high-resolution images and a high frame rate.
The thermopile array sensor consists only of a 0.5cm³ camera (with lens). The system is made easy for integrators with a digital I²C interface, and includes for the first time a silicon lens for low-cost applications. The 32 x 32 array sensor uses a 90µm pixel based on a thermopile technology for a very compact design.
This report provides a detailed teardown and cost analysis of the thermopile die, the silicon lens, the EEPROM die, and the packaging.
This report also includes a comparison between the characteristics of the new and previous versions of the thermopile sensors from Heimann Sensor, and a comparison with FLIR’s ISC1403 microbolometer. This latter comparison highlights differences in each company’s technical choices.
Overview / Introduction
> Executive Summary
> Reverse Costing Methodology
> Heimann Sensor
> Synthesis of the Physical Analysis> Physical Analysis Methodology> Package- Package views, dimensions and marking- Package opening> Silicon Lens- View, dimensions- Cross-section and lens coating> EERPOM Die> Thermopile Die- View, dimensions and marking- Pixels, thermocouples- Cross-section- ROIC characteristics- Process characteristics
Comparison - Heimann Sensor HTPA32x32d vs. Flir ISC1403L
Manufacturing Process Flow
> Global Overview> EEPROM Front-End Process and Wafer Fabrication Unit> ROIC Front-End Process and Wafer Fabrication Unit> Thermopile Front-End Process and Wafer Fabrication Unit> Thermopile Back-End 0: Probe Test and Dicing> Silicon Lens Front-End Process> Back-End - Final Test
> Synthesis of the Cost Analysis> Yields Explanation and Hypotheses- EEPROM die - front-end cost + Wafer and die cost- Silicon lens - front-end cost + Wafer and die cost- Thermopile die - front-end cost + wafer and die cost> Component- Back-end - packaging cost- Back-end - final test cost- Component cost
Estimated Price Analysis
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Comparison between Heimann Sensor and Flir Microbolometer
Manufacturing process flow
Supply chain evaluation
Manufacturing cost analysis
Estimated sales price