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Infineon DPS310 Capacitive Pressure Sensor
Feb.2017

infineon_dps310_pressure_sensor_system_plus_consulting_2017_2
3 290 €

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Description

Infineon pressure flyer

Tiny MEMS digital barometer for smartphones and wearables

The first barometric sensor from Infineon for the consumer market is targeting altitude, GPS, indoor and weather forecasting applications in portable devices. This MEMS sensor positions Infineon to compete with STMicroelectronics and Bosch Sensortec.


Infineon’s DPS310 pressure-sensing device is manufactured using a proprietary MEMS technology developed for and already sold for several years in the automotive market. The sensing element in the DPS310 is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is very small compared to traditional silicon micro-machined membranes. Moreover, Infineon has developed a capacitive sensor to be more accurate and less sensitive to temperature change compared to piezoresistive solutions.

Infineon DPS310 Pressure Sensor System Plus Consulting 2017

For the DPS310, Infineon has introduced two important innovations. The first is a two-die solution more scalable than the monolithic solution used for some automotive pressure sensors.


The second innovation is a plastic metallized lid to replace the classic metal lid. The device comes in a tiny 2x2.5x0.9mm HLGA molded package.


The report presents a detailed analysis of the sensor’s structure and cost. Comparison with the characteristics of the STMicroelectronics pressure sensor LPS22HB and the Bosch Sensortec BMP280 highlights differences in technical choices made by the companies.

 Infineon DPS310 Pressure Sensor System Plus Consulting 2017

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Table of contents

Overview / Introduction


 

Company profile & Supply Chain


 

Physical Analysis


> Package
- Package views and dimensions
- Package opening
- Package cross-section
> ASIC die
- View, dimensions, and marking
- Delayering and process
- Cross-section
> MEMS Die
- View, dimensions and marking
- Sensing area details
- Cross-section sensor capacitor
- Cross-section reference capacitor
- Process characteristics
> Comparison

  

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Manufacturing Process Flow


> ASIC front-end process
> ASIC wafer fabrication unit
> MEMS process flow
> MEMS wafer fabrication unit
> Packaging process flow
> Package assembly unit

 

Cost Analysis


> ASIC front-end process
> ASIC wafer fabrication unit
> MEMS process flow
> MEMS wafer fabrication unit
> Packaging process flow
> Package assembly unit
Cost Analysis
> Yield hypotheses
> ASIC front-end cost
> ASIC back-end 0: probe test and dicing
> ASIC wafer and die cost
> MEMS front-end cost
> MEMS back-end 0: probe test and dicing
> MEMS front-end cost per process step
> MEMS wafer and die cost
> Back-end: packaging cost
> Back-end: packaging cost per process step
> Back-end: final test cost
> Pressure sensor component cost

                                              

Estimated Price Analysis


 

 


About the authors



ABOUT SYSTEM PLUS CONSULTING

System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

 

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

 

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

 

More info at www.systemplus.fr 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

REVERSE COSTING WITH

  • Detailed photos

  • Precise measurements

  • Material analysis

  • Manufacturing process flow

  • Supply chain evaluation

  • Manufacturing cost analysis

  • Estimated sales price

  • Comparison with STMicroelectronics LPS22HB and Bosch BMP280