Tiny MEMS digital barometer for smartphones and wearables
The first barometric sensor from Infineon for the consumer market is targeting altitude, GPS, indoor and weather forecasting applications in portable devices. This MEMS sensor positions Infineon to compete with STMicroelectronics and Bosch Sensortec.
Infineon’s DPS310 pressure-sensing device is manufactured using a proprietary MEMS technology developed for and already sold for several years in the automotive market. The sensing element in the DPS310 is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is very small compared to traditional silicon micro-machined membranes. Moreover, Infineon has developed a capacitive sensor to be more accurate and less sensitive to temperature change compared to piezoresistive solutions.
For the DPS310, Infineon has introduced two important innovations. The first is a two-die solution more scalable than the monolithic solution used for some automotive pressure sensors.
The second innovation is a plastic metallized lid to replace the classic metal lid. The device comes in a tiny 2x2.5x0.9mm HLGA molded package.
The report presents a detailed analysis of the sensor’s structure and cost. Comparison with the characteristics of the STMicroelectronics pressure sensor LPS22HB and the Bosch Sensortec BMP280 highlights differences in technical choices made by the companies.
Overview / Introduction
Company profile & Supply Chain
> Package- Package views and dimensions- Package opening- Package cross-section> ASIC die- View, dimensions, and marking- Delayering and process- Cross-section> MEMS Die- View, dimensions and marking- Sensing area details- Cross-section sensor capacitor- Cross-section reference capacitor- Process characteristics> Comparison
Manufacturing Process Flow
> ASIC front-end process> ASIC wafer fabrication unit> MEMS process flow> MEMS wafer fabrication unit> Packaging process flow> Package assembly unit
> ASIC front-end process> ASIC wafer fabrication unit> MEMS process flow> MEMS wafer fabrication unit> Packaging process flow> Package assembly unit Cost Analysis> Yield hypotheses> ASIC front-end cost> ASIC back-end 0: probe test and dicing> ASIC wafer and die cost> MEMS front-end cost> MEMS back-end 0: probe test and dicing> MEMS front-end cost per process step> MEMS wafer and die cost> Back-end: packaging cost> Back-end: packaging cost per process step> Back-end: final test cost> Pressure sensor component cost
Estimated Price Analysis
ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.
Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.
System Plus Consulting engineers are experts in:
Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.
System Plus Consulting is a sister company of Yole Développement.
More info at www.systemplus.fr
Manufacturing process flow
Supply chain evaluation
Manufacturing cost analysis
Estimated sales price
Comparison with STMicroelectronics LPS22HB and Bosch BMP280