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Intel® Curie™ Module High Density System-in-Package for IoT

3 490 €

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Intel Curie flyer

Ultra-small, low-power hardware module for wearables

Intel®, whose microprocessors can be found in almost every computer worldwide, has commenced the 2016 “wearables race” by introducing the Intel® Curie™ module. This tiny system-in-package (SiP) can be found in the latest Arduino® Board: the Genuino 101 for the European version and the Arduino 101 for the US version. The module includes the Intel Quark chip, Bluetooth low-energy radio, sensors, and battery charging, all in a single package of less than 150mm3.

This complete, low-power solution comes with computing, motion sensing, Bluetooth low energy, battery charging, and pattern matching capabilities for optimal sensor data analysis, enabling quick and easy identification of actions and motions. The module is packaged in a tiny form factor and runs a new software platform created especially for the Intel Curie module.
Located on the main board, the system uses non-conventional packaging developed by Intel. The main microcontroller is located at the bottom of the package, with features like Bluetooth and sensors placed on top.

Package Bottom Intel Curie SiP IoT system plus consulting   Package Cross Section Intel Curie SiP IoT system plus consulting

Powered by the Intel Quark™ SE SoC embedded in the 10-layer build-up coreless PCB, the Intel Curie module is extremely power-efficient - ideal for “always-on” applications like health and wellness, sports activities, etc. Its other features are insured by 13 active dies, plus passives components embedded in the 11x8mm package’s top molding. By integrating several dies and offering several functions, Intel® has realized the smallest low-power complete solution.
This report includes a complete analysis of the SiP, featuring die observation, package cross-section, and a function explanation, analyzing all data related to the module’s cost efficiency.

 XRay view













Table of contents

Overview / Introduction


Company profile & Supply Chain


Physical Analysis

> Physical Analysis Methodology
> Genuino 101 Teardown (European)
- Intel Curie removal
> Curie SiP Packaging Analysis
- Package view and dimensions
- Package x-ray view
- Package opening
- Package cross-section
> Top Packaging Analysis
- Dies and MEMS sensor view, dimensions, and marking
- Dies and MEMS sensor summary
- Dies and MEMS sensor cross-section
> Quark Microcontroller Analysis

- Die view and dimensions
- Die cross-section
- Die process




















































Manufacturing Process Flow

> Chip Fabrication Unit
> Packaging Fabrication Unit
> SiP Package Process Flow



Cost Analysis

> Synthesis of the Cost Analysis
> Supply Chain Description
> Yield Hypotheses
> SiP Package Cost Analysis
- SiP packaging cost
- SiP cost per process step
> Final Test Cost
> Component Cost



Estimated Price Analysis



About the authors


Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses.

The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling. We offer:custom reverse costing analyses, standard reverse costing reports and costing tools within the following fields: integrated circuits, power devices and modules, MEMS & sensors, photonics (LED, Image Sensors), packaging and electronic boards and systems.






































































  • Detailed photos

  • Precise measurements

  • Material analysis

  • Manufacturing process flow

  • Supply chain evaluation

  • Manufacturing cost analysis

  • Estimated sales price

  • Comparison with Huawei Ascend Mate 7 fingerprint sensor

  • Comparison with Apple and Samsung fingerprint buttons