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Intel RealSense D435 3D Active IR Stereo Depth Camera
Jun.2018

intel_realsense_d435_3d_active_ir_stereo_depth_camera_4
3 490 €

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Description

Intel RealSense D435 3D Active IR Stereo Depth Camera couv flyer

The 3D camera is using infrared active stereo depth and red/green/blue sensor, and a VCSEL projector.

Integrated in a compact aluminum case, the Intel RealSense D435 is an intelligent USB-C powered 3D active infra-red global shutter stereo depth camera. It combines a conventional red/green/blue (RGB) color sensor, a vertical-cavity surface-emitting laser (VCSEL) projector and left- and right-side imagers for stereo vision.

 

 

Intel RealSense D435 3D Active IR Stereo Depth Camera 4

 

The 3D camera has a minimum depth of 0.2m and can scan environments up to 10m wide with a resolution depth of up to 1280x720 at 90 frames per second (fps). The system uses a 28nm Intel D4 vision processor for processing complex depth data in real time and a Realtek color image processor.
The infrared laser projector is tiny, measuring only 2.7mm x 1.8mm, uses VCSEL technology and can record 60fps. Omnivision supplies the three image sensors; a CMOS 1080p RGB sensor and twin 1-megapixel sensors for the left and right side imagers.
The components and sensors are contained in ball grid array (BGA) and wafer level packaging, all mounted on two single-sided boards whose total surface area is less than 20cm².

Based on a complete teardown analysis of the RealSense D435, the report provides high definition pictures of the vision processor, VCSEL IR projector and image sensor dies as well as the bill-of-material (BOM) and the manufacturing cost of the depth module.

 

 

Intel RealSense D435 3D Active IR Stereo Depth Camera 1         Intel RealSense D435 3D Active IR Stereo Depth Camera 2       Intel RealSense D435 3D Active IR Stereo Depth Camera 3
 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Table of contents

Intel Company Profile, Camera Main Features and Main Chipset


 

Physical Analysis


> Camera Teardown

> Electronic Boards

- Overview

- High definition photos

- Components markings and identification

> Die Pictures

> Sensors Board Cross Section

> Lens Modules Cross Section

 

 

Cost Analysis


> Accessing the BOM


 

> PCBs Cross Sections and Cost Analysis

> Omnivision OV9282 CIS Die Pictures and Cost Estimation

 > VCSEL Die Pictures, Cross Section and Cost Estimation

> Estimation of the cost of the Lens Module

> BOM Cost - MCU Board

> BOM Cost - Sensors Board

> BOM Cost - Housing

> Material Cost Breakdown

> Accessing the Added Value (AV) cost

> MCU Board Manufacturing Flow and Added Value Cost

> Sensors Board Manufacturing Flow and Added Value Cost

> Details of the System Assembly AV Cost

> Added-Value Cost Breakdown

> Manufacturing Cost Breakdown

 

 

Estimation of the Selling Price - Intel


 

  

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 


About the authors

ABOUT SYSTEM PLUS CONSULTING

System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

More info at www.systemplus.fr 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

COMPLETE TEARDOW WITH

  • Detailed teardown photos

  • Component identification

  • Die pictures

  • PCB cross-sections

  • Lens module cross sections and analyses

  • Intel vision processor physical analysis and cost estimate

  • VCSEL and CMOS image sensor die physical analyses and cost estimates

  • Complete and priced bills-of-material

  • Manufacturing process flow

  • Manufacturing cost analysis

  • Estimated cost and sales price