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InvenSense MP67B - 6-Axis MEMS IMU in iPhone 6 & 6 Plus
Feb.2015

invensense mp67b-icn
2 990 €

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Description

Invensense MP67B flyerInvenSense's first design win in Apple iPhone
InvenSense's Second Generation 6-Axis Devices for Consumer Applications

With 74.5 million units of iPhone sold during the last quarter 2014, InvenSense made a very good deal by replacing STMicroelectronics as the supplier of the gyroscope for the iPhone 6 and 6 Plus.
The MP67B is a custom version of InvenSense 6-Axis device (3-Axis gyroscope + 3-Axis accelerometer) made for Apple. Compared to InvenSense’s standard 6-Axis device MPU-6500, specific modifications have been realized. The main ones consist in the package modification with the use of a LGA substrate compared to a QFN leadframe, and in the ASIC which has been redesigned.

The MP67B uses a different design than InvenSense’s first generation 6-axis device with a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefit of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.
Invensense MP67B img
The report includes a complete comparison with InvenSense standard 6-Axis (MPU-6500) and with InvenSense first generation 6-Axis device.

COMPLETE TEARDOWN WITH:

  • Detailed Photos
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • Supply Chain Evaluation
  • Manufacturing Cost Analysis
  • Selling Price Estimation
  • Comparison with MPU-6500
 

Table of contents

Glossary

Overview/Introduction , InvenSense Company Profile


Physical Analysis

> Package
  • Package Views & Dimensions
  • Package Opening
  • Wire bonding Process
  • Package Cross-Section
> Die
  • View, Dimensions & Marking
  • MEMS Removed
  • MEMS Sensing Area
  • MEMS Cap
  • ASIC Delayering & Process
  • Die Cross-Section: ASIC
  • Die Cross-Section: Sensor
  • Die Cross-Section: Sealing
  • Die Cross-Section: Cap

Comparison with InvenSense MPU-6500
Manufacturing Process Flow

> ASIC Front-End Process
> MEMS Process Flow
> Wafer Fabrication Unit
> Packaging Process Flow & Assembly Unit

Cost Analysis

> Yields Hypotheses
> ASIC Front-End Cost
> MEMS Front-End Cost
> MEMS Front-End Cost per process steps
> Total Front-end Cost
> Back-End : Probe Test & Dicing
> Wafer & Die Cost
> Back-End : Packaging Cost
> Back-End : Packaging Cost per Process Steps
> Back-End : Final Test & Calibration Cost
> Component Cost

Estimated Price Analysis

> InvenSense Financial Ratios
> Component Price 

 


SYSTEM PLUS CONSULTING


Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

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We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
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System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
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Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
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Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

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