Description
World’s first 3D tri-camera bundle including Infineon/pmd REAL3TM ToF image sensor integrated into a consumer smartphones
Recently, camera modules in smartphones have evolved rapidly. All major players have adopted dual cameras. Now, with the Phab2Pro, Lenovo is the first to choose a different approach. As augmented reality plays a bigger part in consumer life, Lenovo is integrating a 3D Time-of-Flight (ToF) camera. The module features three cameras: one with high resolution, a global shutter motion detector and a Near Infra-Red (NIR) sensor.
The Lenovo Phab2Pro brings totally new functionality based on the Google Tango Project. This project, a collaboration including Infineon, pmd and Sunny Optical, has developed 3D ToF sensors for consumer applications.
The Phab2Pro implements this technology using a tri-camera sensor. The subsystem features a 16 megapixel resolution CMOS image sensor (CIS) from Samsung, a VGA resolution CIS with global shutter technology from Omnivision, and a 38 kilopixel resolution 3D Image Sensor from the collaboration between Infineon and pmd integrated into a subsystem with a NIR vertical-cavity surface-emitting laser (VCSEL).
To provide the 3D scene, the tri-camera’s high-resolution camera supplies the texture and the global shutter camera supplies the motion-tracking. Finally, the ToF sensor supplies the depth perception at a high rate thanks to the VCSEL emitter, which gives the phone the ability to understand space and motion quickly, like a human.
The report includes technology and cost analysis of the 3D ToF sensor and technology analyses of the two other modules. These analyses provide the technical intelligence necessary to understand this technology.
Table of contents
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Overview / Introduction
Tri-Camera Module Supply Chain and Company Profile
Lenovo Phab2Pro Teardown
Physical Analysis
> ToF module view and dimensions>
> ToF module disassembly
> Cross-section of the IR sensor module: housing, flex PCB, filter, pads
> 3D image sensors
- View and dimensions
- Pixels
> Cross-section of the 3D image sensor
- Overview
- Pixel array and logic circuit
> IR VCSEL
- View and dimensions
- Cavity EDX
> Cross-section of the IR VCSEL
- Overview
- Wire bonding, epitaxy layers
> Motion detector and High Resolution Cameras Disassembly
- CISs view and dimensions
- CISs pixels
> Cross-section of the camera modules: housing, flex PCB, IR filter, pads, CIS
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ToF Manufacturing Process Flow
> 3D ToF front-end process
> IR VCSEL front-end process
> CIS wafer fabrication unit
Cost Analysis
> The main steps used in the economic analysis
> Yield hypotheses
> 3D image sensor cost
- Front-end cost
- Filter and Microlens front-end cost
- Total front-end cost
- Back-end: tests and dicing
- Wafer and die cost
> IR VCSEL cost
- Epitaxy step
- VCSEL epitaxy cost
- VCSEL front-end cost
- VCSEL wafer cost
- VCSEL cost per process steps
> 3D ToF Module Assembly Cost
> Lens module cost
> Final assembly cost
> 3D ToF module cost
Estimated Price Analysis
> Motion detector and high resolution cameras prices
> Tri-camera 3D ToF module price
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About the authors
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ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.
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