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Maxim Integrated MAX30102 Optical Heart-Rate Sensor

3 290 €

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Maxim HR flyer

Heart-Rate Monitor and Pulse Oximeter Sensor in LED Reflective Solution in the Samsung Galaxy S7

The Nexus 6P is a smartphone designed and manufactured by Huawei. Like in the Ascend Mate 7, the Chinese company integrates a fingerprint sensor from Fingerprint Cards on the back of the device but introduces significant modifications in term of resolution and packaging.

The FPC1025 has been chosen by different smartphone manufacturers; it can be found also in products from Lenovo, ZTE, QiKU, LG and many others.

SystemPlus Consulting report presents a complete report with teardown technical analysis, manufacturing process, supply chain and manufacturing cost analysis of FPC1025.

Maxim DieOverview1 SystemPlusConsulting May2016

 Located on the back side of the smartphone, the fingerprint sensor of the Nexus 6P has dimensions of 11.6 x 11.6mm. It is assembled on a square LGA package and is protected by metal support.

The sensor has a resolution of 15,600 pixels with a pixel density of 508ppi. It uses a capacitive touch technology to takes an image of the fingerprint from the subepidermal layers of the skin.
The sensor die is manufactured with CMOS 65nm technology and is connected by mean of wire bonding to the rigid PCB.Maxim PackageOpening SystemPlusConsulting May2016

The components also includes an ASIC die manufactued using a 0.5µm CMOS process and connected to the flex PCB.

This report includes comparisons with Ascend Mate 7 fingerprint sensor and with the latest Samsung’s and Apple’s fingerprints buttons.

 Maxim LEDSystem SystemPlusConsulting May2016


Table of contents

Overview / Introduction


Company profile & Supply Chain


Physical Analysis

> Physical Analysis Methodology
> Samsung Galaxy S7 Disassembly
    - Component Removal
> Packaging Analysis
    - Package View and Dimensions
    - Package Opening
    - Package Cross-Section
> LED Dies Analysis
    - Dies View and Dimensions
    - Dies Cross Section
    - Dies Process
> Main Die Analysis
    - Die View & Dimensions
    - Die Cross Section
    - Die Process



Manufacturing Process Flow

> LED Fabrication Unit
> LED Process Flow
> Chip Fabrication Unit
> Chip Process
> Package Fabrication Unit
> Package Process Flow




























Cost Analysis

> Synthesis of the Cost Analysis
> LED Cost Analysis
    - Epitaxy Step
    - LED Epitaxy Cost
    - LED Front-End Cost
    - LED Wafer Cost
    - LED Cost per Process Step
> Die Cost Analysis
    - Wafer Front-End Cost
    - Die Cost
> Package Cost Analysis
    - Packaging Cost
    - Component Cost



Estimated Price Analysis

> Manufacturer Financial Ratio
> Estimated Selling Price



Technology and Cost Comparison with Previous Generation of Heart-Rate Sensor



About the authors


Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses.

The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling. We offer:custom reverse costing analyses, standard reverse costing reports and costing tools within the following fields: integrated circuits, power devices and modules, MEMS & sensors, photonics (LED, Image Sensors), packaging and electronic boards and systems.

























































  • Detailed Photos

  • Precise Measurements

  • Material Analysis

  • LED & Module Manufacturing Process Flow

  • Supply Chain Evaluation

  • Manufacturing Cost Analysis

  • Estimated Sales Price

  • Comparison with previous generation