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mCube MC3672: The smallest WLCSP MEMS Accelerometer for Wearables
Mar.2017

mcube_mc3672_side_overview_sem_view_system_plus_consulting
3 490 €

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Description

mCube MC3672 flyer

Ultra-low power, highly integrated WLCSP accelerometer with Via-Middle TSV

With the MC3672, mCube has released the industry’s smallest WLCSP ultra-low power accelerometer for wearables, enabling significantly extended battery life and very small form factors. This new component should increase the company’s market share. One target is earbud applications, like Apple’s AirPods, where power consumption is a major parameter and the space is very limited.

 

Unlike its main competitors, Bosch Sensortec and STMicroelectronics, mCube provides monolithic sensor integration for consumer electronics in a WLCSP package. This uses only wafer level steps to assemble the ASIC, MEMS sensor, MEMS cap and package. Mainly produced by TSMC, which made great efforts to provide complete platforms for MEMS manufacturing, the component is elegantly designed and better integrated than most of its competitors.

 

mCube MC3672 optical view System Plus Consulting

After Bosch Sensortec released a WLCSP 3-axis accelerometer, mCube chose a different approach, although it still uses a Via-Middle TSV process for the package integration. Two TSV processes are used in this component, including for connecting the MEMS sensor to the IC electronics.
The final size is smaller compared than Bosch’s device, at 1.1mmx1.3mmx0.74mm. This is a 45% footprint and 21% thickness reduction compared to the previous 1.6mmx1.6mmx0.94mm mCube MC3635 LGA package and a 64% footprint reduction compared to the present 2mmx2mm LGA package.


The report includes a complete overview of the evolution of mCube’s MEMS accelerometers since the second generation. It also features a detailed technology and cost comparison with leading edge accelerometers from Bosch Sensortec and STMicroelectronics and a process comparison with Bosch’s WLCSP accelerometer.

The report presents a detailed analysis of the sensor’s structure and cost. Comparison with the characteristics of the STMicroelectronics pressure sensor LPS22HB and the Bosch Sensortec BMP280 highlights differences in technical choices made by the companies.

 mCube MC3672 MEMS sensor titled SEM view System Plus Consulting

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Table of contents

Overview / Introduction


 

Company profile & Supply Chain


 

Physical Analysis


> Package
    - Package views, dimensions and pin-out
    - Package cross-section
    - Package opening
> MEMS Cap
> MEMS Sensing Area
    - View, dimensions, and marking
    - Delayering and process
> ASIC Die
    - View, dimensions, and marking
    - Delayering and process
> Cross-section

 

 

  Physical Comparison


> mCube accelerometer evolution
> Comparison with competitors
> Package comparison with Bosch BMA355

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Manufacturing Process Flow


> ASIC front-end process
> ASIC wafer fabrication unit
> MEMS process flow
> MEMS wafer fabrication unit
> Packaging process flow
> Package assembly unit

 

 

Cost Analysis


> ASIC front-end process
> ASIC wafer fabrication unit
> MEMS process flow
> MEMS wafer fabrication unit
> Packaging process flow
> Package assembly unit
Cost Analysis
> Synthesis of the cost analysis
> Yield explanation and hypotheses
> ASIC front-end cost
> MEMS front-end cost
> MEMS front-end cost per process steps
> Total front-end
> WLCSP package cost
> WLCSP package per process steps
> Component cost

                                              

Estimated Price Analysis


 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 


About the authors



ABOUT SYSTEM PLUS CONSULTING

System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

 

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

 

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

 

More info at www.systemplus.fr 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

REVERSE COSTING WITH

  • Detailed photos

  • Precise measurements

  • Material analysis

  • Manufacturing process flow

  • Supply chain evaluation

  • Manufacturing cost analysis

  • Estimated sales price

  • Evolution of mCube accelerometers

  • Comparison of mCube MC3672 versus Bosch and STMicroelectronics accelerometers

  • Comparison of mCube WLCSP process versus Bosch WLCSP process