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MEMS Packaging Reverse Technology Review
Oct.2017

microbolometer_gas_sensor_rf_filter_system_plus_consulting
4 990 €

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Description

MEMS packaging reverse technology report

Comparative packaging analysis of over 100 inertial, environmental, acoustic, optical and radio-frequency MEMS components from major manufacturers

MEMS device manufacturers have to choose between shrinking their products, or and adding functionality. This leads to certain categories of components slowing down packaging integration and evolution.

To complement Yole Développe-ment’s MEMS Packaging 2017 Market report, System Plus Consulting has conducted a comparative technology review to provide insights into the packaging structure and technology of around 80 consumer and 20 automotive MEMS products from leading suppliers, including Bosch, Texas Instruments, Broadcom, STMicroelectronics, Knowles…

MEMs packaging reverse technology report, Microbolometer Gas Sensor RF Filter


Several types of device are compared: Environmental sensors, including pressure, humidity, gas and combo sensors; Inertial devices including accelerometers, gyroscopes, magnetometers and sensor hubs; Optical MEMS including microbolometers and micromirrors; Microphones; and Radio frequency (RF) MEMS including antenna tuners, RF filters and oscillators.

MEMs packaging reverse technology Magnetometer


We look at their package dimensions and internal structures, substrate types, die numbers and dimensions and package cross-sections to answer key questions about MEMS packaging, including:

- What are the main encapsulation processes used by manufacturers, single-chip wafer level packages or multi-chip molded packages?
- What is the preferred interconnection method, wire bonding, flip chip, or through-silicon vias (TSVs)?
- Which innovations can we observe for each manufacturer, and what differences are there between the main competitors?
- Which manufacturers offer the best component integration and which one offers the maximum functionality inside one component?

 

MEMs packaging reverse technology report, STMicroelectronics Package Cross Section


This 300 page report includes multiple comparisons based on physical analyses of over 100 MEMS components. It offers buyers the unique possibility of seeing MEMS package technology evolution, tracked by manufacturer.

 

Companies cited

Alps
ams
Analog Devices
Robert Bosch
FLIR
Infineon Technologies
InvenSense
Maxim Integrated
mCube

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Measurement Specialties
Murata
NXP
Silicon Labs
Sensirion
STMicroelectronics
Texas Instruments
Yamaha
...And more

 


About the authors



ABOUT SYSTEM PLUS CONSULTING

System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

 

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

 

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

 

More info at www.systemplus.fr  

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

REVERSE COSTING WITH

  • Detailed photos

  • Precise measurements

  • Internal packaging structures

  • Package cross-sections

  • More than 80 consumer MEMS components

  • More than 20 automotive MEMS components