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MEMS Pressure Sensor Comparison 2018

4 990 €

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Couv MEMS Pressure Sensors Comparison 2018 System Plus Consulting

Structure and costing comparison of 34 MEMS pressure sensors from 18 different manufacturers in consumer, automotive and industrial applications.

The MEMS pressure sensor market is still driven by automotive applications, but the consumer market has advanced to second place. That’s according to Yole Développement’s MEMS Pressure Sensor Market and Technologies 2018 report. To complement it, System Plus Consulting has conducted a unique comparative review. We provide insights into the structures, technical choices, designs, processes, supply chain positions and costs of seven consumer, 14 industrial and 13 automotive MEMS pressure sensor products from the leading suppliers. The suppliers include All Sensors, Amphenol, APM, Bosch, Denso, First Sensor, Fuji Electric, Freescale, Honeywell, Infineon, Melexis, Merit SensorSystems, Mitsubishi Electric, Nagano Keiki, Sensata, Sensirion, SMI and STMicroelectronics. 


MEMS Pressure Sensors Comparison 2018 System Plus Consulting 5


dimensions and package cross-sections, to provide a comprehensive review of MEMS pressure sensors.

MEMS pressure devices’ packaging and pressure range differ widely according to application. In more than 150 pages, this report includes multiple comparisons based on physical analyses of 34 MEMS pressure sensor components. It offers buyers and device manufacturers the unique possibility of understanding MEMS pressure sensor technology evolution, and comparing product costs.


MEMS Pressure Sensors Comparison 2018 System Plus Consulting MEMS Pressure Sensors Comparison 2018 System Plus Consulting MEMS Pressure Sensors Comparison 2018 System Plus Consulting



Power Module Packaging 2018: Material Market and Technology Trends – by Yole Développement

Power packaging is continuously adapting to power application market trends.



Bundle offer possible with the MEMS Pressure Sensor Comparison 2018 Report by System Plus Consulting, This email address is being protected from spambots. You need JavaScript enabled to view it. for more information.



  • Presentation of thermomechanical issues in power modules
  • 2017-2023 market value for the power electronics field and especially for power modules
  • Complete analysis of power module packaging design
  • Deep insight into each part of a standard power module package: substrate, baseplate, die attach, substrate attach, encapsulation and interconnections
  • Technology trends and roadmaps
  • Detailed analysis of thermal interface materials (TIMs)
  • Presentation of case studies and technological innovations
  • 2017-2023 market metrics and forecasts for each type of packaging component covering substrate, baseplate, die attach, substrate attach, encapsulation, interconnections and TIMs
  • Evolution of different business models among the packaging material suppliers ecosystem
  • Supply chain analysis and evolution trends
  • Complete presentation of Wide Band Gap device packaging
  • Conclusion on the packaging trends for the coming years

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Table of contents

Overview / Introduction

> Executive Summary

> Devices Analyzed

> Reverse Costing Methodology


Structure, Process and Cost Review 

> Consumer

- Bosch
- Infineon
- InvenSense
- STMicroelectronics


> Industrial

- All Sensors
- Amphenol
- First Sensor
- Fuji electric
- Honeywell
- Merit Sensor Systems
- Nagano Keiki
- Sensirion


> Automotive

- Bosch
- Denso
- Fuji Denki
- Infineon
- Mitsubishi
- Sensata























About the authors


System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

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  • Package views and dimensions

  • Package cross-sections

  • Precise measurements

  • Die descriptions

  • Technology descriptions

  • Cost analysis

  • Cost comparisons