Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

Mitsubishi J1- Series 650V High-Power Modules for Automotive
Oct.2018

sp18401
4 990 €

Choose a minimum of three reports from Yole Group and receive a discount of at least 36% on your package – Contact us!
+

 

Description

SP18408 Mitsubishi J1 Series flyer couv

The first power module with 7th-gen CSTBT IGBT and an innovative integrated substrate.

 

The power module device market will post a 10.2% compound annual growth rate (CAGR) over the next five years. This will impact the power module packaging market, which will see a 9.5% CAGR and reach a value of almost $1.8B.

Power modules have come a long way since the early stages of car electrification, and now play a key role in power modulation through all EV/HEVs, from inverters to bi-directional converters. Packaging these modules has become critical due to several technical aspects: moulding, high-temperature die attach, TIM, and connections.

 

SP18408 Mitsubishi J1 Series 650V High Power Module for Automotive image1 logo

 

Power modules must combine good thermal and electrical efficiency, while maintaining a low mass and volume. Also, to remain competitive in an open market, power module makers must deliver high reliability while remaining cost-efficient.

With its new J1-series, Mitsubishi proposes a power module family with voltages in the range of 650V – 1200V, and with a new direct cooling system for automotive applications. Mitsubishi’s modules are extra compact, with IMB 6-in-1 package and pin fin. The modules also integrate the latest Mitsubishi IGBT with Gen7 CSTBT technology and the latest RFC diodes.

System Plus Consulting presents a technology and cost analysis of two J1-series power modules with 650V and 600A/1000A, respectively: the CT600CJ1A060 and the CT1000CJ1B060. This report also provides insights into these modules’ structure, technical choices, design, processes, supply chain position, and cost.

Also included in this report is an analysis of the packaging, IGBT, and diode die, along with a cost analysis for all devices. Moreover, we supply a full comparison between the latest generations of Mitsubishi IGBT and diode. Lastly, we compare this module with the technical choices found in Infineon’s HybridPACK drive and Tesla’s SiC Power module molded with ST SiC MOSFET.

 

  SP18408 Mitsubishi J1 Series 650V High Power Module for Automotive image2 logo SP18408 Mitsubishi J1 Series 650V High Power Module for Automotive image3 logo SP18408 Mitsubishi J1 Series 650V High Power Module for Automotive image4 logo

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

    

 

 

Table of contents

Overview/Introduction


> Executive Summary

> Reverse Costing Methodology

 

Company Profile


> Mitsubishi

> Product Portofolio 

 

 

Physical Analysis


> Synthesis of the Physical Analysis

> CT600CJ1A060 & CT1000CJ1B060

- Package analysis

+ Package opening

+ Package cross-section

- IGBT die

+ IGBT die view and dimensions

+ IGBT die process

+ IGBT die cross-section

+ 6th-Gen vs. 7th-Gen CSTBT

- Diode die

+ Diode die view and dimensions

+ Diode die process

+ Diode die cross-section

+ Standard vs. RFC diode

 

 

Manufacturing Process


> IGBT Front-End Process and Fabrication Unit

> Diode Die Front-End Process and Fabrication Unit

> Final Test and Packaging Fabrication Unit

 

 


 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Cost Analysis


> Synthesis of the Cost Analysis

> Yields Explanation & Hypotheses

> CT600CJ1A060 & CT1000CJ1B060

- IGBT die

+ IGBT front-end cost

+ IGBT die probe test, thinning and dicing

+ IGBT wafer cost

+ IGBT die cost

- Diode die

+ Diode front-end cost

+ Diode die probe test, thinning and dicing

+ Diode wafer cost

+ Diode die cost

- Complete Module

+ Packaging cost

+ Final test cost

+ Component cost

 

 

Price Analysis


> Estimated Sales Price

 

 

Comparison


> Comparison with Infineon’s Hybridpack Drive and Tesla’s SiC module

  


About the authors



ABOUT SYSTEM PLUS CONSULTING

System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

More info at www.systemplus.fr 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

REVERSE COSTING WITH

  • Detailed photos

  • Precise measurements

  • Materials analysis

  • Manufacturing process flow

  • Supply chain evaluation

  • Manufacturing cost analysis

  • Estimated sales price

  • Comparison with Infineon’s HybridPACK Drive and Tesla’s SiC Module