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Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer - Automotive MEMS Combo

3 290 €

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murata flyerMurata’s Second Generation Combo Sensors for Automotive & Harsh Environments

Murata SCC2000 series sensors are combined accelerometer and gyroscope devices aimed at use in tough environments such as those encountered in automotive and industrial applications. The SCC2000 series has best in class temperature dependency, shock sensitivity and bias stability characteristics and consists of a low-g 3-axis accelerometer with two angular rate sensor options of either X or Z-axis detection.

The SCC2000 series features independent acceleration and angular rate sensing elements manufactured with Murata proprietary High Aspect Ratio (HAR) 3D-MEMS process and using SOI and cavity-SOI (c-SOI) substrates. A single ASIC produced with an advanced BCD process is used.

The acceleration sensing element consists of four acceleration sensitive masses and the angular rate sensing element consists of moving masses that are purposely exited to in-plane drive motion.
The SCC2000 devices are packaged in a SOIC 24-pin premolded plastic housing measuring 15.0x8.5x4.1mm. The combo sensor is compliant to the ISO26262 automotive safety standard and the AEC-Q100 stress test qualification requirements for electronic components used in automotive applications.

BMI160 img

SCC2000 series is targeted for applications demanding high stability with tough environmental requirements. Typical applications include: IMUs for highly demanding environments, platform stabilization and control, machine control systems, Electronic Stability Control (ESC), Hill Start Assist (HSA), roll over detection and Navigation systems.

The report includes the analysis of all combo sensors in the SCC2000 series: the SCC2230-E02, SCC2230-D08 and SCC2130-D08. Also a comparison with previous generation SCC1300 series is included.



















Table of contents

Overview / Introduction

Physical Analysis
  •  Package

     > Physical Analysis Methodology
     > Package
     > Package Characteristics Marking & Pin-out
     > Package Opening 
     > Package Cross-Section

  • ASIC Die
      > View, Dimensions & Marking
      > Delayering & Process Identification
      > Cross-Section
  • MEMS Gyro Die

      > View, Dimensions & Marking
      > MEMS Gyro Opening
MEMS Gyro Sensing Structure
MEMS Gyro Electrodes
      > MEMS Gyro Cross-Section

  • MEMS accelero Die

      > View, Dimensions & Marking
      > MEMS accelero Opening
MEMS accelero Structure
      > MEMS accelero Cross-Section

Physical Analysis of SCC2230-D08

Physical Analysis of SCC2130-D08

Comparison with Murata’s previous generation SCC1300

Manufacturing Process Flow
  • Global Overview
  • ASIC Front-End Process & Wafer Fab Unit
  • MEMS Process Flow & Wafer Fab Unit
  • Wafer Fabrication Units
  • Package Process Flow & Assembly Unit 

Cost Analysis
  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test & Dicing
  • ASIC Wafer & Die Cost
  • MEMS Gyro & Accelero Front-End Cost
  • MEMS Gyro & Accelero Front-End Cost per process steps
  • MEMS Gyro & Accelero Back-End 0 : Probe Test & Dicing
  • MEMS Gyro & Accelero Wafer & Die Cost
  • Back-End : Packaging Cost
  • Back-End : Final Test & Calibration Cost
  • MUrata SCC2230 Component Cost

Estimated Price Analysis






Consumer 6-Axis MEMS IMU Cost Comparison (Bosch Sensortec BMI055 & BMI160, Invensense)



























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  • Detailed Photos
  • Precise Measurements

  • Material Analysis

  • Manufacturing Process Flow

  • Supply Chain Evaluation

  • Manufacturing Cost Analysis

  • Selling Price Estimation

  • Analysis of the complete SCC2000 Series: SCC2230-E0, SCC2230-D08 & SCC2130-D08

  • Comparison of SCC2000 series vs. SCC1300 series