NEXT Biometrics presents its innovative fingerprint sensor based on the NEXT Active Thermal™ sensing principle
This reverse costing study provides insight into technological data, manufacturing cost, and selling price of the NEXT Biometrics NB-1010-U and NB-2020-U fingerprint sensor assembly.
The same fingerprint sensor die was found in two different products: a DELL Laptop and the NEXT Biometrics Oyster, an access-control peripheral. Supported by PCB, the fingerprint sensor’s dimensions are 25.2 x 19.0 mm, it is driven by a NEXT Biometrics ASIC, and it is protected by a metal cover. The sensor has a resolution of 46,080 pixels, with a pixel density of 385ppi, and it uses the NEXT Active Thermal™ sensing principle to take an image of the fingerprint.
The sensor die is manufactured on glass with LTPS technology and uses a very specific coating to ensure the device’s functionality. The sensor is connected by wire bonding to the rigid PCB. The assembly, including a rigid and a flex PCB to rigidify the structure, is a very particular process designed by NEXT Biometrics.
This report includes comparisons with the latest Huawei, Samsung, and Apple fingerprint buttons.
Overview / Introduction
Company profile & Supply Chain
> Synthesis of the physical analysis> Oyster fingerprint sensor disassembly - Fingerprint sensor removal - Fingerprint sensor assembly view> Dell Latitude fingerprint sensor disassembly - Fingerprint sensor removal - Fingerprint sensor assembly view - Fingerprint sensor cross-section > Sensor die - Sensor die view and dimensions - Sensor die capacitors - Sensor die edge contacts - Sensor delayering and main blocs - Sensor die process - Sensor die cross-section> IC control unit - Sensor die view and dimensions - Sensor delayering and main blocs - Sensor die process - Sensor die cross-section
Manufacturing Process Flow
> Sensor Die Front-End Process and fabrication unit> LGA Packaging Process> ASICDie Front-End Process and fabrication unit> Final Test & Packaging and fabrication unit> Synthesis of the main parts
> Synthesis of the cost analysis> Main steps of the economic analysis> Yields explanation and hypotheses> Sensor die - Sensor die front-end cost - Sensor die probe test, thinning, and dicing - Sensor die wafer cost - Sensor die cost> ASIC component - ASIC die wafer cost - ASIC die cost - ASIC component packaging cost> Complete module fingerprint - Assembled components cost - Synthesis of the assembly - Fingerprint component cost - Fingerprint component price
Comparison with Huawei, Apple and Samsung fingerprint sensors
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Supply Chain Evaluation
Manufacturing Cost Analysis
Estimated Sales Price
Comparison with Huawei, Apple and Samsung fingerprint buttons