The Nexus 6P is a smartphone designed and manufactured by Huawei. Like in the Ascend Mate 7, the Chinese company integrates a fingerprint sensor from Fingerprint Cards on the back of the device but introduces significant modifications in term of resolution and packaging.
The FPC1025 has been chosen by different smartphone manufacturers; it can be found also in products from Lenovo, ZTE, QiKU, LG and many others.
SystemPlus Consulting report presents a complete report with teardown technical analysis, manufacturing process, supply chain and manufacturing cost analysis of FPC1025.
Located on the back side of the smartphone, the fingerprint sensor of the Nexus 6P has dimensions of 11.6 x 11.6mm. It is assembled on a square LGA package and is protected by metal support.The sensor has a resolution of 15,600 pixels with a pixel density of 508ppi. It uses a capacitive touch technology to takes an image of the fingerprint from the subepidermal layers of the skin.The sensor die is manufactured with CMOS 65nm technology and is connected by mean of wire bonding to the rigid PCB.
The components also includes an ASIC die manufactued using a 0.5µm CMOS process and connected to the flex PCB.
This report includes comparisons with Ascend Mate 7 fingerprint sensor and with the latest Samsung’s and Apple’s fingerprints buttons.
Company profile & Supply Chain
> Physical Analysis Methodology> Fingerprint Button assembly - Fingerprint Scanner Views - Fingerprint Scanner Cross-Section - Fingerprint Scanner Patents
> Sensor Die
- View, Dimensions & Marking - Sensor Die Capacitors - Sensor Die Edge Contact - Sensor Die Delayering & main Blocs - Sensor Die Process - Process & Cross-Section - Sensor Die Process Characteristic
> ASIC - Dimension & Marking - Delayering & process identification - IC process - Die Cross-Section
Comparison Nexus 6P’s vs Ascend Mate 7’s fingerprint sensor
> Sensor Die Front-End Process> LGA Packaging Process > Sensor Die Front-End Process> Final Test & Packaging> Fabrication unit> Synthesis of the main parts
> Sensor Die Front-End Cost, Probe Test, Thinning & Dicing> LGA Packaging Cost> Sensor component cost >ASIC Die Front-End Cost, Probe Test, Thinning & Dicing> ASIC die cost >Assembled Components Cost> Synthesis of the assembling> Fingerprint Component Cost
Technology and Cost comparison with Huawei’s Ascend Mate and Samsung 6S fingerprint sensors
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Manufacturing Process Flow
Supply Chain Evaluation
Manufacturing Cost Analysis
Selling Price Estimation
Comparison with Huawei Ascend Mate 7 fingerprint sensor
Comparison with Apple and Samsung fingerprint buttons