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NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level System-in-Package
Jun.2017

nxp_imx6_multi-die_module_fowlp_sip_system_plus_consulting
3 490 €

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Description

Couv flyer yole NXP iMX6 multi die module FOWLP SiP

The first ultra-small multi-die low power module with boot memory and power management integrated in a package-on-package compatible device for the Internet of Things

In several applications, System-in-Package (SiP) integration of several devices with a very small form factor has become a huge challenge. New markets like the Internet-of-Things (IoT) bring new system configurations looking for low power consumption but high performance. NXP has therefore brought in a tiny wafer-level SiP an application processor that has been well-proven in automotive applications, a power management integrated circuit (PMIC) and a boot memory based on flash technology. Its footprint is about half the size of a discrete implementation on standard PCB.

 

This complete low power solution will be dedicated to Internet-of-Things (IoT) applications for the next few years. The module includes the i.MX6-Quad application processor, MMPF0100 power management system, a 16MB Flash memory and about 100 surface mounted devices, all in a single package smaller than 200 mm3. This is the first multi die fan-out device than we have found in the market, and could be a key milestone for fan-out SiP technology.

 

The system uses non-conventional wafer-level packaging developed by Nepes. It has innovative interconnections, enabling a Package-on-Package (PoP) configuration with Micron’s SDRAM memory chip. A custom redistribution device, called Via Frame, allows memory stacking. These components are integrated in Epoxy Molding Compounds (EMC) on a few redistribution layers (RDL).

 NXP iMX6 multi die module FOWLP SiP System Plus Consulting

 

Powered by the NXP i.MX6 Quad application processor, the Single Chip Module (SCM), SCM-i.MX6Q is extremely power efficient. This makes it ideal to reduce product time to market by simplifying the high-speed memory design and significantly reducing the overall design complexity of the processor/PMIC/memory sub-system. Thanks to the redistributed chip packaging technology applied to this SiP, NXP has realized a complete, very small, low-power, high performance solution.

 

This report includes a complete analysis of the SiP, featuring die analyses, processes, and package cross-sections. It also includes a comparison with TSMC’s inFO and Shinko’s MCeP PoP technology. Finally, it contains a complete cost analysis and a selling price estimation of the system.

 

NXP iMX6 multi die module FOWLP SiP System Plus Consulting 3

NXP iMX6 multi die module FOWLP SiP System Plus Consulting 2

 

 

 

 

 

 

 

 

 

 

Table of contents

Overview / Introduction


 

 

Company profile and Supply Chain


 

 

Physical Analysis


> Physical analysis methodology
> RCP SiP Packaging analysis
- Package view and dimensions
- Package x-ray view
- Package opening: RDL, line/space width
- Package cross-section: RDL, bumps, Via Frame

> Physical Analysis Comparison
- SiPvs discrete
- TSMC’s inFO
- Shinko’s MCeP


> Die analysis: APE, PMIC, Flash Memory
- Die view and dimensions
- Die cross-section
- Die process

 


 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Manufacturing Process Flow


> Die Fabrication Unit: APE, PMIC, Flash Memory
> Packaging Fabrication Unit
> RCP SiPPackage Process Flow

 

Cost Analysis


> Overview of the Cost Analysis
> Supply Chain Description
> Yield Hypotheses
> Die Cost Analyses: APE, PMIC, Flash Memory
- Front-end Cost
- Wafers and Die Costs

> RCP SiPPackage Cost Analysis
- RCP SiPwafer front-end Cost
- RCP SiPcost by process step

                            

Estimated Price Analysis


 

 


About the authors



ABOUT SYSTEM PLUS CONSULTING

System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

 

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

 

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

 

More info at www.systemplus.fr 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

REVERSE COSTING WITH

  • Detailed photos and cross-sections

  • Precise measurements

  • Material analysis

  • Manufacturing process flow

  • Manufacturing cost analysis

  • Estimated sales price