DescriptionThe highest resolution thermal camera for smartphone, 384 x 288 pixels using a microbolometer with 17µm pixel from Ulis.
Based on a high definition microbolometer from Ulis, the Therm-App infrared camera is a high-end product for smartphone. More conservative in their technological choices, the microbolometer is more expensive but better performance. The choice of the quality is also in the camera with the possibility of interchangeable lenses in function of the use. Opgal and Ulis target the professional market and are more in competition with standard IR cameras than with IR cameras for mobile.
The Therm-App camera has a very compact size and is compatible with Android smartphones via its micro-USB-OTG connector. The camera is shutterless and a interchangeable lenses system allow to upgrade the camera for the near or faraway application.
The thermal camera uses a new 17µm pixel design from ULIS. The Pico384P microbolometer, is featuring a 384x288 pixels resolution, 24 times the resolution of the FLIR Lepton and 3 times the resolution of the Seek Thermal (Raytheon EXC001). The sensor technology in the ULIS component is an amorphous silicon microbolometer on 1 level structure. The large pixels allow an excellent NETD of 70mK and a good frame. The PICO384P is based on a complex and modern ROIC die.
To offer the best performances, ULIS encapsulates their microbolometer in a ceramic package more expensive than the Wafer level Package used by Flir and Raytheon.
Based on a complete teardown analysis of the Therm-App Camera and the ULIS microbolometer, the 2 reports provide the bill-of-material (BOM) and the manufacturing cost of the infrared camera as well as a complete physical analysis and manufacturing cost estimation of the infrared module.
To finish, a characteristics comparisons between Flir One, Seek Thermal and Therm-App Cameras and Lepton, EXC001 and PICO384P microbolometers highlights differences in technical choices made by the companies.
COMPLETE TEARDOWN WITH:
- Detailed Photos
- Precise Measurements
- Material Analysis
- Comparison Flir, Seek Thermal and Therm-App camera
- Manufacturing Process Flow
- Supply Chain Evaluation
- Manufacturing Cost Analysis
- Selling Price Estimation
Table of contents
|Opgal – Therm-App
Opgal Company Profile
Physical Analysis Methodology
Accessing the BOM
Estimation of the Cost of the PCB
BOM Cost –
Accessing the Added Value (AV) cost
Electronic Board Manufacturing Flow
Details of the Housing Assembly AV Cost
Details of the Packaging Assembly AV Cost
Manufacturing Cost Breakdown
Estimation of the Manufacturing Price - Opgal
|Ulis – PICO384P
Ulis Company Profile
Manufacturer Process Price
Synthesis of the cost analysis
ROIC Front-End Cost
Microbolometer Front-End Cost
Back-End : Packaging Cost
PICO384P Component Cost
Estimated Selling Price
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