Panasonic adopts a DFN 8x8 package for its normally-off GaN HEMT structure
System Plus Consulting unveils the first GaN HEMT from Panasonic assembled in a dual flat no-lead (DFN) 8x8 package. Panasonic decided to abandon the standard TO220 package, probably because of poor electrical performance.
Thanks to its proprietary X-GaN transistor structure and new die design the company has managed to produce a very competitive normally-off component.
The new PGA26E19BA from Panasonic features a medium breakdown voltage of 600V for a current of 10A at 25°C, with very low on-resistance with respect to its competitors and the TO220 assembled component.
The transistor is optimized to be used in power supplies and AC-DC, photovoltaic and motor inverters. The GaN and AlGaN layers are deposited by epitaxy onto a silicon substrate. A complex buffer and template layer structure is used to reduce the stress and dislocation levels.
Based on a complete teardown analysis, the report provides an estimation of the production cost of the epitaxy, HEMT and package. Moreover, the report compares the new device with GaN Systems’ GS66504B and Transphorm’s GaN HEMT. This comparison highlights the huge differences in design and manufacturing processes and their impact on device size and production cost.
Overview / Introduction
Executive SummaryReverse Costing Methodology
Overview of the Physical AnalysisPackage Analysis> Package opening> Package cross-section
HEMT Die> HEMT die view and dimensions> HEMT die process> HEMT die cross-section> HEMT die process characteristics
HEMT Manufacturing Process
HEMT Die Front-End ProcessHEMT Die Fabrication UnitFinal Test and Packaging Fabrication Unit
Overview of the Cost AnalysisYield Explanations and HypothesesHEMT die > HEMT die front-end cost> HEMT die probe test, thinning and dicing> HEMT wafer cost> HEMT die cost
Complete HEMT> Packaging cost> Final test cost> Component cost
Estimation of Selling Price
Comparison Between Panasonic HEMTs
Comparison Between Panasonic, Transphorm and GaN Systems HEMTs
ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.
Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.
System Plus Consulting engineers are experts in:
Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.
System Plus Consulting is a sister company of Yole Développement.
More info at www.systemplus.fr
Detailed photos and identification
SEM and EDX analysis of epitaxy layers and transistor structure
Manufacturing process flow
In-depth economic analysis
Manufacturing cost breakdown
Selling price estimation
Comparison with Panasonic’s TO220 device
Comparison with Transphorm and GaN Systems devices