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ROHM 1700V SiC MOSFET SCT2H12NZGC11 Discrete

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Rohm SCT2H12NZGC11 1700V SiC MOSFET flyer

In its new series of SiC MOSFETs, Rohm uses trench structures for 650V and 1200V products, while 1700V products use planar structures


After more than five years since SiC MOSFETs were first released, they are gradually penetrating different industries for power conversion applications. The market outlook is promising with a compound annual growth rate of 42% from 2015 to 2021. The forecast for 2017 is expected to be even better than previous years with increasingly positive signals from the industry.

Against this backdrop, Rohm offers a series of new SiC products at different voltages. It appears that it uses trench structures for 650V and 1200V products, while 1700V products use planar structures.

Rohm SCT2H12NZGC11 1700V SiC MOSFET System Plus Consulting 3
The SCT2H12NZGC11 is a 1700V SiC MOSFET from Rohm for industrial and commercial power application such as power supplies. The device offers a quite low on-resistance but very high current density and integrates the second generation high-voltage SiC power MOSFET dies, which now achieve 3.7A current.

Thanks to the die design the device’s cost is very competitive. The gate structure is very simple and the packaging is optimized to save costs.

The report presents a deep technology analysis of the packaging and components with images of the planar SiC structure.


Rohm SCT2H12NZGC11 1700V SiC MOSFET System Plus Consulting




















Table of contents

Overview / Introduction

> Executive summary
> Reverse costing methodology



Company profile

> Rohm Semiconductor



Physical Analysis

> Synthesis of the Physical Analysis
> Package Analysis
- Package opening
- Package cross-section
> MOSFET die
- View & dimension
- Die process
- Die cross-section
- Die process characteristic


MOSFET Manufacturing Process

> MOSFET Die Front-End Process
> MOSFET Die Fabrication Unit
> Final Test and Packaging Fabrication unit













































Cost Analysis

> Synthesis of the Cost Analysis
> Yields Explanation  and Hypothesis

> MOSFET die
- MOSFET front-end cost
- MOSFET probe test, thinning and dicing
- MOSFET wafer cost
- MOSFET die cost
- Wafer cost evolution
- Die cost evolution
> Complete MOSFET
- Assembled components cost
- Synthesis of the assembling
- Component cost


Price Analysis

> Estimated selling price



Company Services 



About the authors


System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

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  • Detailed Photos

  • Precise Measurements

  • Material Analysis

  • Manufacturing Process Flow

  • Supply Chain Evaluation

  • Manufacturing Cost Analysis

  • Estimated Sales Price