Challenges in automotive packaging technologies

An article written by Emilie Jolivet, Yole Développement and Prasad Dhond, Amkor Technology, Inc. for CHIP SCALE REVIEW, May & June issue.

Automotive packaging – Technology & market trends

Four main trends are driving innovation in the automotive industry: electrification, autonomous driving, connectivity, and comfort. Due to environmental considerations, governments want to decrease carbon dioxide (CO2) emission levels by promoting electric cars and developing clean energy consumption. While safety has always been a major factor in modern vehicles, with the expansion of autonomous vehicles, a lot of investment has been made to develop even safer cars. With advanced driver assistance systems (ADAS) in cars and robotic vehicles, passengers’ comfort and entertainment are also becoming a nice “must have” for incabin options.

Today, the automotive industry is looking more and more to the semiconductor industry and expectations for the coming years are getting higher. The car industry represents US$2.3 trillion with a compound annual growth rate (CAGR) of +2.7% over the next five years. Automotive electronics accounts for US$142 billion with a CAGR of +7%. The amount of electronics in a car has increased by 2.5 times since the 90s. Driven by the adoption of more electronics components in endproducts, the semiconductor industry is growing strongly…

Automotive OSAT challenges

Automotive is one of the fastest growing segments in the semiconductor industry. Due to their long lifecycle, automotive applications provide a stable volume base and higher returns on investment (Figure S1). However, the automotive business is also tough and has high barriers to entry. Suppliers must support long lifecycle products to ensure business continuity. Automotive customers are looking for suppliers that have the highest levels of experience, technical capability and quality.

The shift towards advanced packaging in automotive

Although 80% of automotive packaging still uses wire bond technology, the trend is towards advanced packaging. Flipchip ball grid array (FCBGA) is the most popular advanced package for processors used in advanced driver assistance systems (ADAS). The high I/O count, thermal and electrical performance requirements of these processors are best supported using FCBGAs…

To read the full article, Yole Développement and Amkor Technology contributions, please click: Chip Scale Review

Source: http://www.chipscalereview.com,

Related presentations

Liked this post?

Share it on your social networks