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Infrared Imaging Forum 2018 CIOE Yole Developpement


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This year we have brought some changes in the organization, the forum will include 8 presentations and will thus be more focus on industry applications. We want to provide quality contents about applications and technologies within the infrared imaging industry.


9:00 – 9:20 AM - Registration / Badge collection


9:20 – 9:30 AM - Welcome and Introduction 
Yole Développement and CIOE 



9:30 AM – 1:45 PM - Forum

9:30 - 9:50 - Uncooled IR Imaging : seeing the unseen as a new commodity

The future for uncooled IR imagers is bright as numerous areas of expansion exist: thermography, personal night vision systems, automotive night vision, defense … while new opportunities will arise such as smart homes, mobiles, autonomous cars … Driven by a virtuous circle where new applications are requiring larger volume coupled to a price decrease that, in turn, are opening new applications … the market for uncooled IR imaging technology will continue to grow in the coming years.  Join the Yole analysts and discuss the key challenges and applications of the uncooled IR imaging at the 2018 CIOE event.

Eric Mounier

Dr. Eric Mounier, Senior Analyst,Yole Développement 
With almost 20 years of experience in MEMS, Sensors and Photonics applications, markets, and technology analyses, Dr. Eric Mounier provides deep industry insight into current and future trends. As a Principal Analyst, Technology & Market, MEMS & Photonics, in the Photonics, Sensing & Display division, he is a daily contributor to the development of MEMS and Photonics activities at Yole Développement (Yole), with a large collection of market and technology reports as well as multiple custom consulting projects: business strategy, identification of investments or acquisition targets, due diligences (buy/sell side), market and technology analysis, cost modelling, technology scouting, etc. 
Previously, Dr. Mounier held R&D and Marketing positions at CEA Leti (France). 
He has spoken in numerous international conferences and has authored or co-authored more than 100 papers.

Eric has a Semiconductor Engineering Degree and a Ph.-D in Optoelectronics from the National Polytechnic Institute of Grenoble (France). 



9:50 AM - 10:15 AM - State of the art of Mid-End Thermal Imaging Sensors performances in mass production

The significant level of expertise accumulated by ULIS and CEA/LETI enables ULIS to mass produce mid-end (QVGA resolution) Thermal Imaging Sensors, based on microbolometer technology, with state of the art performances, proven repeatability and stability. Key characteristics of QVGA product line are described to highlight the production performances and stability over years: NETD, operability, high uniformity and robustness. Moreover ULIS 12µm technology approach will be described. Finally, ULIS unique product platform, as a key way to speed up thermal imaging cameras development for manufactures, will be detailed.

François Trolez ULIS CIOE IR 2018 yole

François Trolez, Product Line Manager, ULIS 

François TROLEZ received his Master degree in Marketing and Business development from the University of Technology of Compiègne in 2003. After several position as a consultant in Innovation and Engineering, he joined ULIS in 2007 as a Competitive Intelligence Engineer. In 2010, François took the position of Strategic Business Analyst, with focus on the Smart Building Market and in the MIRTIC project (European project). In 2013, François evolved as Market Manager, he led market analysis for both core business markets and emerging markets. Since 2017, François TROLEZ is Product Line Manager, managing ULIS QVGA products range.



10:15 AM - 10:40 AM - InGaAs SWIR Sensing Technologies and its Applications


In this talk, we will give a general introduction of InGaAs based SWIR sensing technologies from raw material to finished camera. The knowledges from this introduction will help industrial players to better understand InGaAs SWIR sensors and to make a better choice for their purchase according to their needs. Some typical applications will be presented and analyzed in connection with the fundamental imaging performance of a camera. Then we will present the product development in New Imaging Technologies SA on InGaAs SWIR sensors, especially the latest WidySens sensor which provides both an ultrawide dynamic range (>120dB) and a very low noise (<50e). The cameras based on this sensor can cover a large variety of applications in industrial fields. A live demo will be made during the workshop.



Yang Ni, CTO,New Imaging Technologies SA
Yang Ni has received the B.Sc on Electronics from South-East University, Nanjing China in 1985, M.Sc/Ph.D/HDR from South Paris University, Orsay France in 1988/1990/1998. He was a full professor at Institut National des Telecommunications leading the smart CMOS image sensor group till 2007. He founded New Imaging Technologies in 2007 in order to commercialize the solarcell mode photodiode based logarithmic image sensors.  Yang Ni has published more than 50 papers in journals and conferences and is author of more than 20 patents. He is actually CTO of New Imaging Technologies and also Emeritus Professor at Institut-Telecom Sud-Paris.



10:40 AM - 11:05 AM - Small array detector development and applications

The small array microbolometer detector is entering the fields that used to be dominated by single element detectors such as pyroelectric and thermopiles. At the same time, the thermopile and pyroelectric suppliers are developing array sensors to enhance their performance and sales margins. However, both technologies are facing severe challenging such as cost reduction and diversified application requirements etc. This talk will summarize the recent development of various small array infrared sensors on the market, with focusing on the development and applications of small array microbolometer detectors.


DALI LijunJiang Lijun, DALI Technology 

Lijun Jiang, Deputy General Manager of Zhejiang Dali Technology, he received his Ph.D. degree from New Jersey Institute of Technology in Materials Science and Engineering in 2004, and has been working in the field of infrared detectors for more than 16 years. 


11:05 AM – 11:35 AM - Tea break and networking


11:35 AM - 12:00 PM - Paving the way to more security autonomous cars with uncooled IRFPA technology

Presention of the overall environmental perceptions of autonomous vehicles, followed by a despription of IRFPA.
The key technology and progress of IRFPA entering autonomous vehicles especially covering small pixel technology, WLP technology, TEC-less technology, sunsafe technology and mass production.


Dr. Wang Peng, Chip Division, R & D Director,IRAY Technology
Research field: Infrared and THz focal plane array chips, optical MEMS chips.




12:00 PM - 12:25 PM - Molded GASIR optics for next generation uncooled detectors 

Currently two important trends can be observed in microbolometer dimensions. On the one hand pixel size is shrinking to 12µm and smaller, allowing for lower detector cost and more compact systems. On the other hand, FPA’s are being promoted with lower resolutions and very small sizes, aiming at smart sensing applications rather than imaging applications.

We evaluate the effect on the optical requirements of both trends. We conclude that smaller pixel sizes lead to a need for faster and more costly optics, while very small FPA’s and wide FOV’s benefit of cost advantages that millimeter sized optics offer. Umicore has developed a wafer level molding technology to respond to the volume and cost requirements of these smart sensing applications.


Tom Krekels IR CIOE forum yole 2018

Tom Krekels, Director of Strategy, Umicore

Dr. Tom Krekels has a background in materials science, and has hands-on experience with the technical and business aspects of electron-, laser- and thermal imaging optics. At Umicore he is responsible for the strategic business development within the optics department. He’s a keen technology trendwatcher, and is always looking for opportunities to turn Umicore’s capabilities into added-value.




 12:25 PM - 12:50 PM - Uncooled IR imagers: Structural and cost review of low-cost solutions 


Over the past ten years, the uncooled infrared (IR) imaging market has been driven primarily by defense applications. The cost/performance ratio has not yet opened the way to consumer applications. However, this is changing. Manufacturing costs are decreasing, with the introduction of new manufacturing processes such as wafer level optics, wafer level packaging, and silicon lenses.

Where the market demands small arrays below 32x32 pixels, microbolometers are not cost competitive, so thermopile and pyroelectric sensor suppliers are growing in this market segment.

Based on pictures extracted from physical analyses of several microbolometers and thermopiles, the presentation will highlight the latest trends and the evolution in term of manufacturing process and package integration, with a focus linked to miniaturization and cost reduction. 


Romain Fraux System Plus Consulting

Romain Fraux, CEO, System Plus Consulting

Romain Fraux is Chief Executive Officer (CEO) at the company System Plus Consulting, specialized in the reverse costing analysis of electronics, from semiconductor devices to electronic systems. 
Supporting industrial companies in their development, Romain and his team are offering a complete range of services, costing tools and reports. They deliver in-depth production cost studies and estimate objective selling price of a product, all based on a detailed physical analysis of each component in System Plus Consulting laboratory. Thanks to his deep technical expertise and his knowledge of the industrial landscape, Romain performs costing analyses of MEMS devices, Integrated Circuit and Advanced Packaging. He has significant experience in the modeling of the manufacturing costs of electronics components as well.
Romain has spoken in more than 20 industry conferences worldwide over the last 10 years.
Romain holds a BEng from Heriot-Watt University of Edinburgh (Scotland) in addition to a master's degree in Microelectronics from the University of Nantes (France). 



12:50 PM - 1:15 PM - Modern Assembly technology for Packaging of IR Microbolometers 


Packaging of High Vacuum Microelectromechanical Systems (MEMS) devices continues to be a major production challenge. For successful operation, many MEMS devices such as inertial sensors, IR microbolometers, RF devices, atomic clocks and optical switches require a high vacuum or a precisely controlled inert gas atmosphere. Plus, the assembly process requires accurate temperature environment. Producing a high quality IR microbolometer is the result of a number of different elements including the capabilities of the furnace, along with the materials used. This presentation will discuss the market requirements for Wafer Level Packaging IR Microbolometers from a system and a tooling design perspective. It will present the best capabilities needed in a furnace, such as how to precisely align the ceramic/kovar package to the lid during the sealing process, how to limit thermal impact to the package with the die and the solder alloy on the package, along with other capabilities. It will also present specific requirements for the materials used in the packaging of these High Vacuum MEMS devices. Lastly, several case studies of typical IR microbolometer packaging challenges will be presented.


Alex Voronel SST Vacuum YoleAlex, Voronel, Director of Global Sales, SST Vacuum Reflow Systems

Mr. Alexander Voronel is a Director of Global Sales for SST Vacuum Reflow Systems, based in Downey CA, USA.  Mr. Voronel brings more than 30 years of experience in the back-end assembly through his previous work in wire bonding technology at Orthodyne Electronics/K&S as European Sales Manager and for the past 6 years in vacuum reflow technology at SST. 





1:15 PM – 1:25 PM - Thank you and adjourn




Please contact Julie (This email address is being protected from spambots. You need JavaScript enabled to view it.) for any question or application.
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