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3D Sensing Forum 2018 CIOE Yole Developpement

 

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AGENDA
 

 

 

The schedule is not confirmed and thus willing to change

 

1:00 PM – 1:30 PM - Registration / Badge collection 

 

1:30 PM – 1:40 PM - Welcome and Introduction 

Yole Développpement & CIOE

 

1:30 PM – 5:15 PM - Forum

 

1:40 PM - 2:10 PM - 3D sensing for consumer : the game changing interface

 

3D sensing is setting a new paradigm for human to device interaction in the smartphone space and is heading toward consumer electronics ubiquity. This newly embedded technology is built around a complex set of sub-components assembled to provide scene understanding beyond the traditional 2D video. Depth perception in this market is a difficult task knowing the constrained cost, space and power considerations. Join the Yole analysts and discuss the key challenges of underlying sub- components for 3D sensing in the consumer space.

 

Pierre Cambou

Pierre Cambou, Imaging Principal Analyst - Technology & Market,Yole Développement 
Pierre Cambou joined the imaging industry in 1999. Following an engineering degree from Université de Technologie de Compiègne in parallel to a master of science from Virginia Tech in 1998, as well as graduating from Grenoble Ecole de Management’s MBA, Cambou took several positions at Thomson TCS, which became Atmel Grenoble in 2001 and e2v Semiconductors in 2006. In 2012 he founded Vence Innovation, now called Irlynx, in order to bring to market a disruptive man-to-machine interaction technology. He joined market research and strategy consulting company Yole Développement (Yole) as Principal Analyst, Technology & Market, Imaging in 2014, within the Photonics, Sensing & Display division. 

 

 

2:10 PM - 2:40 PM - Hard & Core Technology Change the World — Consumer Photon Age Approaching

 

The underlying technology represented by optical computing (optics, machinery, electricity, algorithms) has been promoting the technological transformation of human beings. The development of mechanical technology promoted the first industrial revolution, and the power electronics technology promoted the second industrial revolution. The hard science and technology represented by integrated circuit (electricity 1970s) computer software (algorithm 1980s) optical fiber communication (optical 1990s) Internet (algorithmic 2000s) promoted the third industrial revolution characterized by information technology. At present, almost all of the scientific and technological products are based on the " optics, machinery, electricity, algorithms " technology. The future development of " optics, machinery, electricity, algorithms " trend will turn to chip; the electricity turn to integrated circuit, light will be developed to integrated optical path, computer to MEMS chip.

In the past 50 years, with the development of the integrated circuit industry in the world, the characteristic size of integrated circuit chips has tended to the physical limit, and it has become a trend for photons to replace electrons. Optoelectronic chip will be the cornerstone of the whole information industry in the future. Optoelectronic integrated chip technology has the advantages of low power consumption, high speed, high reliability, small volume and so on. It will be a key link in the fields of optical transmission, optical information processing and exchange, optical access and optical and wireless fusion. Playing a more and more important role is the only way to break through the bottleneck of speed and energy consumption of information network, and will become a revolutionary technology in the future. With the development of optoelectronic integrated artificial intelligence (algorithm) technology, the fourth industrial revolution characterized by intelligence is coming.

In the information age, integrated circuits promote the development of consumer electronics industry, and bring the global consumer electronics industry market of more than trillion dollars every year. Optoelectronic chips, as the hardware foundation of the intelligent age, have promoted the development of the related industries. The iPhone X has for the first time integrated the consumption-grade optoelectronic chip modules. The era of consumer photons, the future of consumer photons will produce a trillions of dollars in the market.

 

Mi Lei

Mi Lei, Founding Partner and Co-CEO of Xi’an CAS Star; Ph.D. of Optical Science, Xi’an Institute of Optics and Precision Mechanics of CAS; Executive Director of Shaanxi Institute of Advanced OEIC Technologies; Vice-Director of Young Scientists’ Social Responsibility Alliance.
Devoted himself to industrialization of scientific and technological achievements, Dr. Mi compiled the concept of “hard & core technology”, initiated the Hard & Core Technology Innovation Alliance and pointed out that “tech entrepreneurship will be the mainstream of China’s development in the next thirty years”. With the aim of driving the regional economic development and creating the tech-startup ecosystem, Dr. Mi has founded the first angel fund and incubator that targeted at the field of hard & core technology in China, which has invested and incubated more than 230 high-tech companies with the amount of 1.5 billion CNY,and created 5000 new job opportunities. In 2017,Dr. Mi won the CAST-Qiu Shi Outstanding Scientist Award and the China Young Entrepreneur Award.

 

 

2:40 PM - 3:10PM - Volume Manufacturing of 3D Sensor VCSELs

 

Babu Dayal PADULLAPARTHI Ph. D, VCSEL Development Director - SanAn Optoelectronics Company

 

3:10 PM – 3:40 PM - Coffee Break and Networking

 

 

3:40 PM - 4:10 PM - TBD

 

Romain Fraux System Plus Consulting

Romain Fraux, CTO, System Plus Consulting

Romain Fraux is Chief Technology Officer (CTO) at the company System Plus Consulting, specialized in the reverse costing analysis of electronics, from semiconductor devices to electronic systems. 
Supporting industrial companies in their development, Romain and his team are offering a complete range of services, costing tools and reports. They deliver in-depth production cost studies and estimate objective selling price of a product, all based on a detailed physical analysis of each component in System Plus Consulting laboratory. Thanks to his deep technical expertise and his knowledge of the industrial landscape, Romain performs costing analyses of MEMS devices, Integrated Circuit and Advanced Packaging. He has significant experience in the modeling of the manufacturing costs of electronics components as well.
Romain has spoken in more than 20 industry conferences worldwide over the last 10 years.
Romain holds a BEng from Heriot-Watt University of Edinburgh (Scotland) in addition to a master's degree in Microelectronics from the University of Nantes (France). 

 

 

4:10 PM - 4:40 PM - Mass Production of NIR filters for 3D Sensing

 

Dr Clau Maissen, Senior Product Marketing Manager, Evatec

 

 

4:40 PM - 5:10 PM - TBD

 

Bernd Buxbaum, CEO, pmdtechnologies

 

 

 5:10 PM – 5:15 PM - Thank you and adjourn

 Yole Développpement & CIOE

 

 


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