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3D Sensing Forum 2018 CIOE Yole Developpement

 

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AGENDA
 

 

 

 

1:30 PM – 2:00 PM - Registration / Badge collection 

 

 2:00 PM – 5:45 PM - Forum

 

2:00 PM – 2:10 PM - Welcome and Introduction 

Yole Développpement & CIOE

 

 

2:10 PM - 2:35 PM - 3D sensing for consumer : the game changing interface

 

3D sensing is setting a new paradigm for human to device interaction in the smartphone space and is heading toward consumer electronics ubiquity. This newly embedded technology is built around a complex set of sub-components assembled to provide scene understanding beyond the traditional 2D video. Depth perception in this market is a difficult task knowing the constrained cost, space and power considerations. Join the Yole analysts and discuss the key challenges of underlying sub- components for 3D sensing in the consumer space.

 

Pierre Cambou

Pierre Cambou, Imaging Principal Analyst - Technology & Market,Yole Développement 
Pierre Cambou joined the imaging industry in 1999. Following an engineering degree from Université de Technologie de Compiègne in parallel to a master of science from Virginia Tech in 1998, as well as graduating from Grenoble Ecole de Management’s MBA, Cambou took several positions at Thomson TCS, which became Atmel Grenoble in 2001 and e2v Semiconductors in 2006. In 2012 he founded Vence Innovation, now called Irlynx, in order to bring to market a disruptive man-to-machine interaction technology. He joined market research and strategy consulting company Yole Développement (Yole) as Principal Analyst, Technology & Market, Imaging in 2014, within the Photonics, Sensing & Display division. 

 

 

2:35 PM - 3:00 PM - Reliable front end processing for VCSEL mass production

 

Taking the VCSEL technology to 6inch mass production is a challenge currently faced by many manufacturers. 3D sensing, including techniques such as face recognition, has start-ed a wave of investments across the world and launched the race to VCSEL mass production. In this race, careful design and processing sequence are keys to success.
In VCSEL manufacturing, a lot of emphasis has been put on mastering the epiwafer structure in order to gain control of the apertures. Additionally, to achieve reliable electro opti-cal performances and maximize the yield, careful front end processing remains critical. As the market demand increases, the transition to 6inch brings challenges on surface quality and uni-formity. For applications requiring arrays of VCSELs for higher combined output power, the threshold current and differential quantum efficiency have to be uniform from laser to laser within an array.
To address these challenges, Oxford Instruments Plasma Technology has designed a set of solutions, exposed in a breakdown of fabrication steps from the process flow of VCSEL, see figure 1. Associating strong process expertise and extensive device understanding, our latest processing solutions are focused on meeting key processing requirements to demon-strate 6inch capacity... Read more.

  

Ian Wright Oxford Instruments yole cioe

Ian Wright, VP, Sales & Service, Asia, Oxford Instruments Plasma Technology

Ian joined Oxford Instruments in 2016 but has been in the industry for more than almost 30 years and has been especially involved in the development of plasma solutions for the MEMS, Optics, Optoelectronics and Packaging markets segments. He was also one of the original team to bring the ‘Bosch’ Silicon DRIE to market in the mid 90’s whilst at STS. He has a Bachelor's degree in Mechanical Engineering with many years’ experience in the plasma process equipment industry, formerly at STS and then SPTS in a number of sales & marketing roles globally before joining OI. Ian has been based in Singapore for the last 13 years.

 

 

3:00 PM - 3:25PM - Volume Manufacturing of 3D Sensor VCSELs

 

Sanan Optoelectronics Co. Ltd, (Sanan Opto.) HQ in Xiamen City of Fujian Province, has been a well-established company in LED manufacturing since 2000. Since 2014, Xiamen Sanan Integrated Circuit Ltd. (SAIC), a fully owned subsidiary of Sanan Optoelectronics Co. Ltd. has its product portfolio in (GaN, SiC, GaAs based) RF ICs and Power Devices. Due to Sanan Opto. and its subsidiaries strong manufacturing bases across China and emerging new markets demands for Consumer Electronics, it is aggressively investing in all key areas of Photonic Components. Thus recently from 2017, SAIC expanded its R&D and manufacturing activities to VCSELs, FP-DFB lasers, PDs etc. At CIOE-18, Sanan will introduce SAIC company profile, business model and high volume manufacturing capabilities of VCSEL arrays for Consumer Electronics applications. To achieve its high volume manufacturing goals, SAIC has developed dedicated 4" & 6" process lines with strict ESD compliance of Laser components handling and building necessary in-house infrastructure. Some of our VCSEL arrays are in a transition from R&D to customer qualification stage that leads to production for future customer/market needs in consumer (3D Sensing, Automotive and Industrial) applications.

 

Babu dayal padullaparthi SananBabu Dayal PADULLAPARTHI Ph. D, VCSEL Development Director - SanAn Optoelectronics Company

Babu Dayal PADULLAPARTHI received his B.Sc. Degree from Andhra University (PG College in Rajahmundry) in 1994, and his M. Sc., M. Phil., and Ph.D., degrees from Andhra University (Rajahmundry), University of Hyderabad (HCU), and IIT Delhi in 1997, 1999 and 2005 respectively, all in Physics, from India. He has worked in Tokyo Institute of Technology (Tokyo Tech., Japan) as Post-Doc on VCSELs during 2005-2009 and Visiting Scientist in RRCAT Indore, India between 2010-2011, working on High-Power FP-Lasers. He was also worked as Assistant Professor in JUIT in 2011, Shimla, India and then joined SAE Magnetics HK Ltd, A TDK Japan Company for developing High-speed VCSELs for Datacom between 2012-2016. Since 2017, he has been Director of VCSEL development at Sanan Optoelectronics Co. Ltd. (Hong Kong & Xiamen). His R&D and manufacturing interests have been in the area of III-V Optoelectronic Devices & Semiconductor Lasers, especially VCSELs for Datacom & Sensing applications. He has co-authored >40 papers in leading technical journals and conferences and holds >10 Granted & Filed Patents.  He was recipient of MRS-2004 Fall Meeting Outstanding Poster Award, JSPS Post Doctoral Fellowship (2005) and currently a member of IEEE IPS, OSA and SPIE.

 

3:25 PM – 3:55 PM - Coffee Break and Networking

 

 

3:55 PM - 4:20 PM - Review of Consumer 3D Sensing Technologies

 

3D Sensing has been introduced on the consumer market a few years ago, but since late 2017 and the release of the iPhone X with Face ID a lot of companies have been investigating this space. 2018 will see at least two others smartphone OEM embedding 3D sensing for Face recognition: Oppo with the Find X and Xiaomi with the MI8 Explorer Edition. Integrating these modules is very challenging due to the limited space and the related cost.
Three main technologies are used in 3D sensing for consumer: Structured light, Stereo Vision, and Time of Flight. Based on pictures extracted from physical analyses of several modules from the leading players (pmdtechnologies, Intel, Apple…), the presentation will highlight the latest technologies trends for the key components (dot projector, NIR imager, VCSEL) and the evolutions in term of manufacturing process and package integration.

 

Romain Fraux System Plus Consulting

Romain Fraux, CEO, System Plus Consulting

Romain Fraux is Chief Technology Officer (CTO) at the company System Plus Consulting, specialized in the reverse costing analysis of electronics, from semiconductor devices to electronic systems. 
Supporting industrial companies in their development, Romain and his team are offering a complete range of services, costing tools and reports. They deliver in-depth production cost studies and estimate objective selling price of a product, all based on a detailed physical analysis of each component in System Plus Consulting laboratory. Thanks to his deep technical expertise and his knowledge of the industrial landscape, Romain performs costing analyses of MEMS devices, Integrated Circuit and Advanced Packaging. He has significant experience in the modeling of the manufacturing costs of electronics components as well.
Romain has spoken in more than 20 industry conferences worldwide over the last 10 years.
Romain holds a BEng from Heriot-Watt University of Edinburgh (Scotland) in addition to a master's degree in Microelectronics from the University of Nantes (France). 

 

 

 

4:20 PM - 4:45 PM - Philips Photonics - Your correct VCSEL partner for 3D sensing:  volume experience, technical competence and capacity readiness

Volume experience: the longest experience and highest shipped volume to cell phone industry between VCSEL companies as absolute success story. 
Technical competence: Competence covering all three levels from VCSEL chip over Optical till packaging.
Capacity readiness: Sufficient capacity and stable supply chain as key success factor to support high volume.

 

Wang Yi Philips Yole CIOEYi Wang, Senior Manager Business Development, APAC, Philips

Graduated from the Bremen University in Germany, with a double master's degree in Electronics and Information Technology and Business Economics. From 2006 to 2009, he worked for Infineon Technologies in Munich, Germany. In 2009, he joined the Philips Optoelectronics Chip Division in Ulm, Germany, where he was responsible for the Asia Pacific region. In 2014, he transferred to Philips in China and served as Senior Business Development Manager of Philips Optoelectronics, responsible for Philips Optoelectronics' Asia Pacific business. 

 

 

 

 

 

 

 

4:45 PM - 5:10 PM - Mass Production of NIR filters for 3D Sensing

 

When applications in mobile industrial sensing like gesture recognition, proximity and 3D sensing use a source such as an NIR LED or VECSEL to illuminate the scene, the detector in turn requires a high performance NIR filter to separate the signal wavelength from the background light.

Achieving the required accuracy and repeatability in deposition of the optical stacks at high throughput and low cost are already demanding manufacturing challenges, but the challenges are further compounded by the additional need to handle thin glass wafers typically in the 200 to 400 micron range safely. Controlling the introduction of any stress to avoid wafer warpage during the deposition process itself is also then essential not only for continued safe handling but also to avoid problems for downstream process steps such as dicing, and finally particle levels must be strictly controlled to main the required process yields.

The application of such optical coatings on a wafer level at the volumes and levels of process control required calls for a different manufacturing approach. Implementing optical deposition and process control know how on a fully automated platform with handling and tracking capability compliant with the semiconductor industry is the ideal manufacturing solution as the worlds of “Optics” and “Semiconductor” increasingly converge.

Typical process results on such a production tool will be presented to show how optimised sputter technology combined with in situ optical and plasma emission monitoring enable high deposition rates, optical accuracy and repeatability. System architecture will also be explained to show how full automation including handling, tracking and wafer flip are essential to achieve high productivity at low particle levels.

 

Clau Maissen EvatecDr Clau Maissen, Senior Product Marketing Manager, Evatec

Clau Maissen is a physicist who gained his PhD  at ETH Zürich, Switzerland in 1992. He has over 20 years experience in the field of coatings technology holding various management positions in  development and manufacturing of coatings for optical and solar applications. Immediately prior to joining Evatec he worked for six years in the development and manufacturing of complete optical systems.  In March 2018 he became Senior Product Marketing Manager for Evatec’s Photonics Business Unit.

 

 

 

 

5:10 PM - 5:35 PM - PMD Time-of-Flight – the Swiss Army Knife of 3D depth sensing

 

The market-leading Time-of-Flight technology from pmd is integrated into two AR-Smartphones on the market - with more to come soon! pmd ToF already helps four AR headsets to understand the world! pmd ToF makes smart home cameras smart! pmd ToF lets robots see and navigate. pmd ToF is proven to make face recognition more secure. And pmd ToF will be used in cars soon.

We are convinced that our depth-sensing technology is as flexible as your application needs it. Like a real Swiss Army Knife. During the talk, you will learn what we already have archived with our 3D ToF technology and how you and your application can benefit from it. You will learn why depth sensing is one secret sauce for AR, VR, MR and other markets and their applications. Discover what pmd offers in terms of available reference designs, delivered data and software interfaces - and how all of this fits into a digital 3D world.

 

pmdtec bernd buxbaumDr. Bernd Buxbaum, Chairman of the Executive Board, pmdtechnologies

Dr. Bernd Buxbaum is founding CEO and CTO of the pmdtechnologies ag – the worldwide leading 3D Time-of-Flight digital imaging technology supplier. To date pmd shipped well over one million sensors and is the main technology provider for Googles Project Tango and owns over 350 worldwide patents concerning pmd-based applications.
Dr. Buxbaum was born in 1970 and studied Microelectronics and Business Administration at Darmstadt University of Technology as well as University of Siegen and received his Ph.D. in Optoelectronics in 2002. He is also an entrepreneur and investor in High-Tech companies as well as member of several supervisory boards and gives lectures at renowned Universities. Today he leads a team of over 100 highly specialized employees to develop and shape the future of 3D sensing.

 

 

 

 5:35 PM – 5:45 PM - Thank you and adjourn

 Yole Développpement & CIOE

 

 


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