The last edition of this symposium on Advanced Packaging was held on Wuxi on April 2014. It gathered 70+ participants, including :
Advanced Materials, Air Liquide, Air Products and Chemicals, Akrion Systems, AMEC, Amkor Technology, Analog device, ASE Group, Atotech, Beijing Future Sky Tech., BroadPak, Cirrus Logic, Consensic, Dow Chemical, Dow Corning, EPCOS Technology, EPWorks, Hitech Semiconductor, Holland High Tech China Center, Huatian Technology, Huawei Technologies, Jipal Corporation, JSR, Kingyoup Optronics, KLA-Tencor, Nagase, Nanjing silverMicro Electronics, Nantong Fujitsu, Omron, QST Corporation, ROHM Semiconductor, Rudolph Technologies Chian Branch Office, SCHOTT Asia, SEMI, Shanghai Institute of Microsystem, Shinkawa, Sinochip Semiconductors, SMIC, SPIL, SPTS Technologies, SUSS MicroTec, Sumitomo Bakelite, TESEC China, Tsinghua University, Xpeedic Technology, Zeta Instruments, Zhuhai Advances Chip Carriers & Electronic Substrat Solutions technologies (ACCESS), (non exhaustive list).
Find the previous agenda here
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