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 Fan-Out Wafer Level Packaging Reports Bundle

Increased return on investment with minimal spend

 

Fan-out is now a key advanced packaging platform for automotive and mobile applications.

Fan-Out packaging has been available and in production since 2010 from first Infineon launch but the market has really started to grow from 2015 with the adoption of the FO packaging platform for telecom products (baseband, PMU/PMIC, etc.), radar modules... and expected this year application processors linked to the collaboration between TSMC and Apple. Also the new multi-chip and SiP FO technologies will now soon be available in volume production for very large applications. So FO is now the new advanced packaging platform to take care of...

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Choose a minimum of three reports from Yole Group of Companies (including Yole Développement, System Plus Consulting and KnowMade) and receive a discount of at least 39% on your package - Contact This email address is being protected from spambots. You need JavaScript enabled to view it.

Discover below the complete list of reports you can mix and match within your bundle:

 

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  • Fan-Out Wafer Level Packaging Patent Landscape Analysis
    With Apple and TSMC changing the game, 2016 is a turning point for the Fan-Out market. The number of enforceable patents is increasing worldwide, with several companies already standing out by virtue of their strong IP position - More
  • Patent Licensing Companies in the Semiconductor Market -Patent Litigation Risk and Potential Targets
    The semiconductor industry has all the attributes that appeal to patent licensing companies (PLCs): Are you in their sights? - More

 

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