LEADING-EDGE TECHNOLOGIES AND TECHNOLOGY NODES
Huge investments worldwide from the likes of TSMC and SK Hynix, underpin this technology node right now, making this metric one to watch. “We’ve all heard about the buzz in Europe, the US, Taiwan and South Korea surrounding investments to establish a supply chain for these leading-edge technologies,” asserts Romain Fraux, CEO of System Plus Consulting. “In this context, it’s really important to track how these technology nodes are being used in the smartphones industry.”
Technology nodes of 14 nm down to 5 nm represent 27% of die area in
devices. Importantly, around 1.9 million units of 12-inch wafers are shipped per
quarter using these technology nodes. Meanwhile some 2.2 million and 1.0
million units of 12-inch wafers are shipped with the legacy 28-16 nm and 90-32
nm nodes per quarter, respectively.
“You won’t see a metric like this anywhere else,” highlights Fraux. “For silicon wafer manufacturers, for example, this is so important as you can understand your market in terms of wafer size, technology and other segments.”
COMPONENT, PACKAGING AND SILICON CHIP: WHAT ARE THE TECHNICAL CHOICES MADE BY SAMSUNG, APPLE…?
Electronic costing and technology experts at System Plus Consulting have released the Smartphone Design Win Monitor which provides unique industry insight into the latest component, packaging and silicon chip choices of smartphone makers.
Much of the detail is based on teardowns from System Plus Consulting, which uncover the innovative design features and new semiconductor components within a smartphone. “You can often find some online data on, say, chipset providers, but this will only provide a small part of the entire picture,” says Romain Fraux. “With our quarterly Smartphone Design Win Monitor, we are providing an exhaustive view of the content of the smartphones we’ve analysed in terms of technology choice, based on our many tear-downs.”
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