“The die attach equipment market is showing a 6% CAGR between 2018 and 2024”, announces Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea. “This industry will reach US$1.3 billion by 2024, fueled by assembly and packaging opportunities created by semiconductor megatrends”.
The latest semiconductor manufacturing report from Yole Développement (Yole) , titled Die Attach Equipment Market, is dedicated to the back-end packaging equipment industry with detailed technical roadmaps and a benchmarking of the related equipment. Die attach is a key process step for all semiconductor packaging companies. Today it becomes more and more strategic, with lot of issues as it regards all devices across various applications.
In this context, the market research and strategy consulting company proposes a comprehensive overview of this industry with technical insights and business trends. In this new report, Yole’s analysts segment and investigate the die attach equipment business by various parameters including bonding technologies and applications at the device level. This report reveals the competitive landscape with more than 70 companies identified and a detailed analysis of the supply chain. It is also a good opportunity to discover an in-depth analysis of the die bonder and flip-chip bonder markets.
Yole propose you today to discover the status of the die attach equipment market.
Today’s semiconductor megatrends include mobile devices, big data, AI , 5G wireless networking, HPC , IoT including industrial IoT, smart automotive, industry 4.0, and data centres. These applications create demand for electronics hardware, which requires high computing power, high speed, more bandwidth, low latency, low power, more functionality, more memory, system level integration and a variety of sensors. Such trends create business opportunities across various electronic device packaging platforms. However advanced packaging has one of the best opportunities, as it can fulfil various performance and complex heterogeneous integration requirements… Full article
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