Extended temperature range for VCSELs and Photodiodes // Increase in reliability and performance // Datacom solutions for 112Gbps per channel in development.
TRUMPF Photonic Components, a German-based global leader in VCSEL (Vertical Cavity Surface Emitting Lasers) and photodiode solutions for data communications will showcase new products for datacom at European Conference on Optical Communication (ECOC) in Bordeaux, France (September 13th -16th 2021, booth 501).
The high-tech company has a new generation of VCSELs and photodiodes with superior performance at higher temperatures thanks to an extensively upgraded manufacturing platform with enhanced process control and better yields. The VCSELs feature fully passivated die and extra mechanical protection for the mesa for enhanced reliability. The matching photodiode has low dark current and additional ground pad for better shielding which also provides ground-signal or signal-ground options for mounting. With these features, TRUMPF enables cost savings for its data center and high-performance computing customers not only from the reduced energy cost from less cooling, but also from less device related failures in the field.
“With our strong heritage in VCSEL and photodiode technology, we are continuously working to push the boundaries of what is possible” said Ralph Gudde VP of Marketing and Sales. “While we are pleased to offer expanded temperature range on our devices up to 56Gbps today, we are now focusing on bringing our 112Gbps solutions to the market early next year, with first samples targeted for December 2021” he added. Next to the data communication market, the company also offers solutions for consumer electronics, industrial sensing and industrial heating markets.
TRUMPF will be demonstrating its 56Gbps VCSEL and photodiode functioning as a link in collaboration with transimpedance amplifier (TIA) and VCSEL driver at ECOC in Bordeaux, France.
Related Reports and Monitors
Edge Emitting Lasers – Technology and Market Trends 2021
Market & Technology
Status of the Advanced Packaging Industry 2021
Market & Technology