The “Status of Advanced Substrates 2019” report, now available, focuses on three main advanced packaging substrate platforms: advanced integrated circuit (IC) substrates including flip-chip chip scale packaging (FCCSP) and flip-chip ball grid arrays (FCBGA); substrate-like printed circuit boards (SLP); and embedded die (ED). This year’s report has in-depth coverage of the technology, players, markets and supply chain, focusing on market analysis, size, share, forecast and describing the landscape for the various advanced substrate platforms.
The total addressable market (TAM) of advanced substrates is expected to grow from $5.3B in 2018 to $10.7B by 2024 with a Compound Annual Growth Rate (CAGR) of 10%. That’s more than twice the 4% CAGR of the overall printed circuit board (PCB) market. This shows that supply chain players value and will pay for innovation in substrate manufacturing.
Advanced substrate technology developers have stepped up their game due to the strong influence of advanced packaging’s higher level of expertise and performance. The goal is to address new challenges coming from mega-trend driven requirements. In the report, we provide an in-depth analysis with a holistic view that justifies our market size estimate and competitive landscape description.
As we have seen in the advanced packaging sector overall, miniaturization, greater integration and higher performance are all becoming key features for advanced substrates. Applications like fifth generation (5G) wireless technology are demanding FCBGA substrates. Memory is progressively switching from wire-bond to FCCSP. SLP adoption beyond Apple’s smartphones is in progress. Huawei is the latest SLP user, and will take it to another level. Meanwhile, for the ED packaging platform, technology improvements and market dynamics are finally paving the way towards further acceptance in mobile, telecom, infrastructure and automotive markets.
On the other hand, each platform is driven by a specific market. It is therefore impossible to generalize as each technology must satisfy specific requirements for a particular market and application. FCCSP is driven by memory, while FCBGA is required for telecom and computing where greater integration and higher performance are compulsory. SLP is a perfect fit in mobile, where reducing the board surface area is critical. ED is a solution for heat management, and power efficiency parameters that are vital for markets such as electric vehicles, telecom and infrastructure. However, in principle, advanced substrate technologies are generic and can be deployed in other markets, giving them a significant advantage over specialized technologies.
Japan is still the center of innovation in this field but Taiwan and China are improving at an amazing rate. Considering global PCB maker revenues, Taiwan is in the lead, followed by Japan and China. The latter will quickly move into runner-up position as huge efforts and investments are ongoing in parallel with environmental regulations China put in place to regulate and consolidate its PCB and substrate manufacturing. With the strong desire of PCB makers to secure new business coming from electronics manufacturers, a clash of advanced substrate giants is inevitable moving forward. There will definitely be more exciting developments and opportunities foreseeable in years ahead. Stay tuned!
About the author:
As a Technology & Market Analyst, Advanced Packaging, Mario Ibrahim is a member of the Semiconductor & Software division at Yole Développement (Yole). Mario is engaged in the development of technology & market reports as well as the production of custom consulting studies. He is also deeply involved in test activities business development within the division.
Prior to Yole, Mario was engaged in test activities development on LEDs at Aledia. He was also in charge of several R&D advanced packaging programs. During his 5 years stay, he developed strong technical & managerial expertise in different semiconductor fields.
Mario holds an Electronics Engineering Degree from Polytech’ Grenoble (France). He spent 3 apprenticeship years within Imaging Division of STMicroelectronics Grenoble, where he contributed to the test benches park automation within the test & validation team.
Status of Advanced Substrates 2019
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On July 2nd, 5:00 PM CET / 8:00 AM PDT
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