EV/HEV are driving power module packaging innovations

The power module is key in the development of power converters and inverters,” says Milan Rosina, PhD., Principal Analyst, Power Electronics & Batteries, Yole Développement (Yole). “At Yole, we expect this market to reach US$6 billion by 2024, with a 6.6% CAGR.”
“In the past, packaging needs were driven by industrial applications”, comments Amine Allouche, Junior Costing Analyst at System Plus Consulting. “But time has changed, and today’s market is increasingly driven by EV/HEV. By 2024, the EV/HEV market segment will surely become the biggest power module market.”

Both environmental regulations to reduce average CO2 emissions and other automotive trends play in favor of stronger vehicle electrification and faster deployment of EV/HEVs. And Yole’s power electronics team expects that EV/HEV market in numbers of vehicles will reach 24 Million units by 2024.

Increasing battery energy capacity enables longer driving range of electric cars while powerful electric motors enable quick acceleration. High electric power requirement as well as need for inverter downsizing brings challenges on the power module level.

Power electronic innovations affect different solutions, such as power module (power card-like power module), baseplate structure (pin fin), and cooling technology (double-side cooling). The evolution of the technologies has been analyzed in-depth by Yole’s analysts in a dedicated report, Status of the Power Module Packaging. In this report, they reveal the latest innovations.“Major technology trends are related to substrates, die-attach, and interconnections,” asserts Shalu Agarwal, Technology & Market Analyst at Yole. “Although no major packaging technology breakthrough has been observed over the last several months, many technology trends from the past have been confirmed.”

“As one of the leaders of the automotive segment, Hitachi has, for example, defined a unique strategy combining technical innovations to follow this evolution. It includes double-side cooling, “direct” cooling using structured housing, use of dielectric insulation based on AlN and more…” adds Amine Allouche from System Plus Consulting… Full article

Source: http://www.yole.fr/, https://www.systemplus.fr/

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