The 16th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, on March 2-5, 2020. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
Yole Développement will participate in the following:
Future of Fan-out Packaging: Fan out packaging gains wider adoption expected to surpass $2B threshold by 2024 as lines between OSAT and foundry gets blurry
On March 4, 2020 from 9.30AM to 9.30AM
Vaibhav Trivedi, Sr. Technology Market Analyst, Yole Développement
Fan out packaging started out as a niche technology in 2011. Fan-out packaging technology built strong momentum where it was expected that it will replace many laminate-based packages posing significant threat to substrate suppliers. Over past ten years, it seems that fan-out packaging has found its rightful place in many high-density applications and in core-fan out arena which primarily remains the realm of the OSATs. This “niche” area driven by the need for advanced L/S, heterogeneous integration, need for thinner, increased I/O count and more reliable packages (side wall protection). Fan-out packaging landscape remains exciting with many players and technologies such as traditional eWLB, panel level processing, Deca’s M-series products, TSMC’s integrated fan-out and its variants, and FoCos (ASE). Fan-out packages are also gaining traction for multi-die system in package devices where more than one die is reconstituted, and additional passives are included in such a package. Fan-out platforms remains a more economical choice compare to 2.5D package construction with interposer design. With advancement in fan-out materials and rise in panel level manufacturing investment led by ASE, Deca, PTI, and Samsung Electronics, it is certain that fan-out package platform will remain either a stepping stone in more advanced level packages or final choice for small and thinner path to heterogeneous integration. This presentation will cover key players, applications and markets for fan-out packaging as well as providing market forecast and evolution of fan-out packaging technology for coming years.
Yole Développement will be exhibiting at Booth #58 with our experts on hand to answer questions and discuss your needs.