2nd Executive Forum on 3D Sensing for Consumers

Yole Events

Shenzhen, China

Envision the future of 3D sensing technology and ecosystem

The second Yole Développement and CIOE forum on 3D Sensing!

After a successful 1st edition, Yole Développement is proud to collaborate once again with the China International Optoelectronic Expo (CIOE) to organize the 2nd Executive Forum on 3D Sensing for Consumers. It will take place on September 5, 2019 in Shenzhen, alongside the 21th CIOE. This event will present applications and technologies within the 3D sensing industry, and more specifically consumer-oriented solutions.

In the past two years 3D sensing has become a major technology milestone for consumer electronics. In 2017 the iPhone X brought a major disruption with a touch-less biometric interface using a 3D structured light camera. The full consumer electronics industry is now in motion to adopt 3D sensing as a new touch-less user interface . In the process new technologies are entering such as Time of Flight cameras and Active Stereo Vision. As space and dollars are a scarce resource on the front side of phones, the application of 3D sensing is now starting on the rear of phones and expending into tablets, smart assistants, and payment devices.

Join us for this event and participate in discussions about this transformational technology for the consumer electronics industry!

Key reasons to be here!

A half-day dedicated to 3D Sensing for Consumers
6 high level presentations
Unique access to leading players and experts
Networking time to discuss with your peers

Don’t miss this opportunity to exchange with key players !

Registration

Executive Forum on 3D Sensing: early bird prices until August 9, 2019

Standard Rate: 195€ – Early bird rate: 160€

Additional discounted rates available if you register to more than 1 forum organized by Yole Développement and CIOE :

2 Forums Standard Rate: 285€ – Early bird rate: 235€
3 Forums Standard Rate: 415€ – Early bird rate: 345€
4 Forums Standard Rate: 545€ – Early bird rate: 465€

Registration available!

Co-located forums

Organized by Yole Développement & the CIOE

Silicon Photonics Forum - Yole Developpement - CIOE

1st Executive Forum on Silicon Photonics
September 4th, 2019

Background LiDAR Auto Forum Yole CIOE 2019

2nd Executive Forum on LiDAR for Automotive
September 5th, 2019

3rd Executive Infrared Imaging Forum - Yole Développement - CIOE 2018 — Courtesy of FLIR

4th Executive Infrared Imaging Forum
September 6th, 2019

Sponsorship opportunities available

Sponsoring the Executive Forum on 3D Sensing for Consumers is a prime opportunity to put your company in front of more than 80 of the key industry players and decision makers of the industry. The forum is the unique single-meeting event in China exclusively dedicated to 3D sensing, where you will be able to meet and talk with key players. Find more details here.

Program draft

September 5th, 2019

2:00 pm - 6:00 pm

Forum

2:00 pm - 2:15 pm

Registration

2:15 pm - 2:20 pm

Welcome

Yole Développement & CIOE

2:20 pm - 2:45 pm

Envision the future of 3D imaging & sensing

Pierre Cambou

Imaging Principal Analyst

2:45 pm - 3:10 pm

Sony’s ToF application exploration in consumer area

Michiki Mikuriya

General Manager, iToF System Product Department, Mobile & Sensing Systems Business Division at Sony Semiconductor Solutions

Sony has been accelerating its development of ToF product after the merger of SoftKinetic Systems S.A. in 2015. The first ToF commercial product released to the market is Sony's entertainment robot "aibo" in 2017. After that, first back-illuminated high performance ToF product followed and was released in 2018, used in several smartphones. Throughout those activity, Sony has been very active developing not only ToF sensor itself, but all the reference design of optics, illuminators, commercial software for ToF signal processing, and even joint development of application software like AR gaming, in cooperation with major game venders. In this Forum, Sony ToF representative present how ToF works in general, compared to other technologies such as stereo camera, structured light, And update such recent application development status, and further prospect how consumer experience will change in the long term, through depth sensing technology.

3:10 pm - 3:35 pm

3D Sensing Solutions

Allan Frederiksen

VP OSS System Engineering at ams AG

While mastering the core technologies across the different 3D sensing fundamental techniques, taking a system approach to building 3D solutions is essential for driving the performance further and solve the integration and complexity challenges with new space requirements e.g. in mobile. With co-design of algorithms and various HW building blocks, cost and performance of known technologies like active stereo can be improved further. Having system capability is also a pre-requisite for evaluating usage of 3D systems in emerging applications, to ensure right availability of technology when the application will get wider adoption, and enables providing turn-key solutions is an enabler for addition of 3D sensing to new applications,

3:35 pm - 4:00 pm

Review of Consumer 3D Sensing Technologies

Romain Fraux

CEO of System Plus Consulting

3D Sensing has been introduced on the consumer market a few years ago, but since late 2017 and the release of the iPhone X with Face ID a lot of companies have been investigating this space. Most of the OEM have now integrated 3D sensing, for face recognition or depth sensing. Integrating these modules is very challenging due to the limited space and the related cost. Three approaches have been considered in consumer applications: active stereo vision (AS), structured light (SL) and Time-Of-Flight (ToF) sensing. SL was developed by Apple, which brought it to the market for the first time in 2017. It’s based on a complex system requiring several components, including a Global Shutter (GS) image sensor and a dot projector. The latter has been considered difficult and expensive to make due to the precision required. The ToF approach could be less complex and less expensive due to the only need of a ToF Image sensor and a flood illuminator to bring depth sensing to a system. Based on pictures extracted from physical analyses of several modules from the leading players the presentation will highlight the latest technologies trends for the key components and the evolutions in term of manufacturing process and package integration.

4:00 pm - 4:40 pm

Coffee Break

4:40 pm - 5:05 pm

Performance, Precision and Productivity: Solutions for VCSEL fabrication.

Stephanie Baclet

Senior Technical Marketing Engineer at Oxford Instruments Plasma Technology

As VCSEL technology transitions from Data Communication to Face ID, world facing 3D sensing and potentially LiDAR the design and fabrication process of VCSEL dies must be altered. In order to enable high resolution sensing at long distance, the optical output power of the laser diode must increase. To increase power, VCSEL designers have several options these include increasing the number of emitters within an array. However, tighter control of front-end processing is required to fabricate denser VCSEL arrays. Additionally, increasing the density also increases instabilities in the electro optical performance of the laser because of thermal cross talk between emitters in the same die. As a result, VCSEL designers must compromise and find a balance between cost and performance. They must increase the size of the die in order to increase spacing between emitters. This primary need leads to less device per wafer and therefore a higher die cost. Oxford Instruments Plasma Technology offers a path to cost efficient high performance VCSEL array manufacturing. The mesa dry etching solution focuses on yield, cost and performance. Mesa processing with ultra-low footing on vertical mesas enables manufacturers to produce VCSEL dies with higher density of emitters thanks to precise control of etching depth on high aspect ratio features. Ultra-low footing is achieved in combination with ultra-smooth sidewalls across full wafers, achievable with cost effective photo resist patterning. Overall, high etch processing uniformity at 150mm wafer delivers the performance and high yield manufacturing required to enable the next generation of VCSEL devices.

5:05 pm - 5:30 pm

A Roadmap to the future of 3D sensing technology

Dr. Chen Zhi

Vice President at Orbbec

After the launch of iPhone X and Find X smartphones, the IOS and Android smart phones have had the first wave of adopting 3D sensing technology for non-contact biometric identification purposes. Since then, various technologies are explored, including structured light, stereo vision and time-of-flight. The supply chain is maturing to prepare more applications of 3D sensing in our daily life. In this talk, we will review the various methods in the markets from a technical perspective, and show various applications from Orbbec's global customers.

5:30 pm - 5:55 pm

Applications of Specialty Glass in 3D Sensing Technologies

Guangjun Zhang at SCHOTT (Shanghai) Precision Materials & Equipment International Trading

Senior Manager Business Development at SCHOTT

TBD

5:55 pm - 6:00 pm

Thank you and adjourn

Speakers

Pierre Cambou
Imaging Principal Analyst at Yole Développement
Romain Fraux
CEO at System Plus Consulting
Stéphanie Baclet
Senior Technical Marketing Engineer at Oxford Instruments Plasma Technology
Michiki Mikuriya
General Manager at Sony Semiconductor Solutions
Chen Zhi
Vice President at Orbbec
Allan Frederiksen
VP System Engineering, OSS at ams AG
Guangjun Zhang
Senior Manager Business Development at SCHOTT (Shanghai) Precision Materials & Equipment International Trading

Partners

Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy consulting, corporate finance services, reverse engineering and costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, Yole Group of Companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, Software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics, Batteries & Energy Management and Memory.

Yole, along with its partners System Plus Consulting, PISEO, Knowmade and Blumorpho, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business. More information on www.yole.fr. Follow Yole on LinkedIn and Twitter.

CIOE (China International Optoelectronic Exposition) is the world’s largest exhibition in optoelectronic industry. It is the first as well as the most influential optoelectronic exhibition in China. The event is an annual gathering for the global optoelectronic professionals to gather around to network with business partners and discover the future trends. CIOE presents an entire optoelectronic industry chain. It is a meeting place where you could meet the people from every corner of optoelectronics fields including optical communications, lasers, semiconductors, infrared Imaging, precision optics, and photonics.

Computing and Software Imaging Lighting Photonics and Lighting Semiconductor Manufacturing Sensing and Actuating

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