3D Packaging: A disruptor of the semiconductor supply chain
With the increase in demand for cloud and edge computing, a high-level of performance is increasingly observed at end-system devices in datacenter storage, switching, networking, and High-Performance Computing (HPC) as well as in consumer devices, personal computing, and gaming. These are the key major trends driving the growth of the 2.5D/3D Packaging market.
Without doubt, the industry is seeking alternative ways to design & manufacture the latest SoCs using SiP and chiplet based approaches by leveraging different advanced packaging technologies and a mix of both latest & mature nodes. This demands 2.5D/3D integration of semiconductor components, addressable only by high-end performance packaging. In a slowing Moore’s Law environment, industry is now heavily reliant on high-end packaging breakthroughs to address the high-performance computing requirements by improving 2.5D/3D interconnect density and thus system-level functions.
In this webcast, Yole Développement and System Plus Consulting join forces to provide an understanding of today’s 2.5D/3D packaging market and its evolution. Based on Yole Développement’s analysis, the 2.5D/3D packaging market is expected to reach $4.3B by 2025 from $871M in 2019, with a CAGR of 30.5%. Giant players, such as Intel, TSMC and Samsung, have effectively tapped into the advanced packaging market’s growth with both FE and BE capabilities. They have achieved faster time-to-market than OSATs for high-end performance packaging, at an historically unprecedented scale. This strategy of the big players poses a direct, formidable threat to OSATs.
Meanwhile, System Plus Consulting will provide thorough cost and technical analyses of recent devices using 2.5D/3D integration technology. Join us for this important webcast and enrich your understanding of this field.
Finally, this webcast will help you to understand that within 2.5D/3D Packaging, the OSATs’ business is being cannibalized by foundries and IDMs. Moving forward, the fabless model may become more attractive thanks to cutting-edge turnkey services, such as the latest silicon node manufacturing technology coupled with advanced packaging. Fabless companies and design houses are looking to optimized packages for value-for-money, especially for high-end applications. If big players can provide both quality and cost benefits, then OSATs may have to remain defensive.
Intel Foveros 3D Packaging Technology
Intel Core i5-L16G7: the first utilisation of Intel’s Foveros Technology with Package-on-Package configuration in a consumer product.
Status of the Advanced Packaging Industry 2020
OSATs, foundries, and IDMs all want to impact the growing advanced packaging market.
High-End Performance Packaging: 3D/2.5D Integration 2020
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?
Technology & Market Analyst, Package Assembly and Substrate
Technology & Cost Analyst