3D Sensing for Consumer Forum 2020

Yole Events

Shenzhen, China

The second wave of 3D sensing technology: Could Time-of-Flight be the decisive technology for future consumer applications?

The 3rd Yole Développement and CIOE forum on 3D Sensing for Consumer.

After a successful 2nd edition, Yole Développement is proud to collaborate once again with the China International Optoelectronic Expo (CIOE) to organize the 3rd Executive Forum on 3D Sensing for Consumers. It will take place on September 10, 2020 in Shenzhen, alongside the 22th CIOE. This event will present applications and technologies within the 3D sensing industry, and more specifically consumer-oriented solutions.

Android-based mobile device manufacturers have added front depth sensors to their products, and are now striving to enable applications that additionally leverage rear-side-mounted depth sensors.

So far, at least, these new applications are predominantly photography-related. In the near future, however, they’re expected to further expand into augmented reality, virtual reality and other applications, following in the footsteps of Google’s trendsetting Project Tango experiment of a few years ago. Yole Développement will describe the application roadmap, market value and cost of these highly anticipated mobile 3D sensing modules. With rumors suggesting that time-of-flight camera modules will also begin appearing on the rear sides of iPhones, we will see the impact on the business.

The new iPhone should be released by Apple on the day of this Forum, so join us and participate to this event to get the latest information about this exciting industry!

Key reasons to be here!

A half-day dedicated to 3D Sensing for Consumers
6 high level presentations
Unique access to leading players and experts
Networking time to discuss with your peers

Don’t miss this opportunity to exchange with key players !

Onsite & Online Registration

Onsite Standard Rate: 195€ – Early bird rate: 160€
Early bird prices exended until August 14, 2020
This offer include onsite access to the conference, proceedings, network time, coffee breack and a VIP CIOE badge (here is what is included in it).

Additional discounted rates available if you register to more than 1 forum organized by Yole Développement and CIOE :

2 Forums Onsite Standard Rate: 285€ – Early bird rate: 240€
3 Forums Onsite Standard Rate: 415€ – Early bird rate: 350€
4 Forums Onsite Standard Rate: 545€ – Early bird rate: 465€

Online rate: 90€
This offer include online access to the conference and proceedings.

2 Forums Online Rate: 130€
3 Forums Online Rate: 190€
4 Forums Online Rate: 250€

Sponsorship opportunities

New location!

Co-located forums

Program

Sept. 10, 2020

2:00 pm - 6:00 pm

3D Sensing Forum

2:00 pm - 2:15 pm

Registration

2:15 pm - 2:20 pm

Welcome & Introduction

2:20 pm - 2:45 pm

3D imaging and sensing: Mid-2020 review

Richard Liu

Imaging Market & Technology Analyst at Yole Développement

It has been more than half a year since 2020, let’s review the development of 3D market in the past six months. First of all, we will review the market of mobile phone, and then talk about was the "web celebrity" product, the consumer LiDAR module, from have already released the iPad pro and the upcoming iPhone 12, what significant impact will it have on the supply chain and applications? Automotive is another important market for 3D imaging and Sensing, which is also the most anticipated market of LiDAR products. What are its new updates?We will share the new information that we have learned. 2020 is a very special year, that's the world epidemic of COVID-19 and Its impact is huge and far-reaching. Last, let’s talk abou this impact on this market, hoping to give you an understanding of how the 3D market evolving in particular situations.

2:45 pm - 3:10 pm

Time-of-Flight is here to stay, but where is it going? - Online

Dr. Bernd Buxbaum

CEO and Founder at pmdtechnologies ag and Executive Board Member at ifm group of companies

In his presentation Dr. Bernd Buxbaum, CEO at pmdtechnologies ag will give a deep dive into the future developments of 3D depth sensing with special attention to the Time-of-Flight technology and the pmd principle which he co-developed 20 years ago. After a small lookback to the early developments and breakthroughs that paved the way for today's technological advances, he will focus on the three different markets Consumer, Industrial and Automotive. Exemplarily he will give a detailed overview on how the integration of 3D-cameras has enhance products and applications in these markets. Further, he will give an outlook into the future of Time-of-Flight depth sensing, technological developments, current challenges and its potential for major markets and products.

3:10 pm - 3:35 pm

The new trend of ToF in consumer applications

Fanxiao Kong

Co-Founder and CMO of Silicon Integrated

In past few years, smartphone is the major driven power of ToF technology, especially with the release of Apple’s latest iPad Pro and iPhone Pro series, ToF has been brought to the consumer’s daily life. On the other hand, we also see the widely usage of ToF in different areas, such as faceID payment, smart home appliance, household drones etc. The various applications bring different requirements to ToF technology. Here we will discuss the trend of ToF in mobile market, and opportunities, challenges brought by more emerging consumer applications.

3:35 pm - 3:45 pm

Break

3:45 pm - 4:10 pm

Next generation VCSELs

Xiaochi Chen

General Manager at Vertilite

Many exciting progresses in 3D sensing have been achieved over the past few years driven by the booming market in mobile, retail payment, smart home and automotive. However, challenges are still existing as emerging technologies propose unprecedented requirements. One of the key parts and key challenges in 3D sensing is the emitter. This presenttion will first introduce the performance, reliability and mass production capability of Vertilite conventional VCSELs, which have been implemented by more than 10 million of smartphones for iToF application. Furthermore, Vertilite's next generation VCSELs, which is designed an suited for long-distance 3D sensing such as LiDAR, will be presented.

4:10 pm - 4:35 pm

浅谈TOF那些事儿 Let's talk about the ToF sensing technology

Jianfeng Feng

3D Product Manager at Sunny Optical

With the development of digital imaging technology, as one of the three mainstream solutions in the field of 3D depth vision, ToF technology frequently appears in a variety of mobile phone products. We will introduce the working principle of ToF technology in detail, analyze the rise of the demand-side market and the attentions for ToF products. We’ll share the advantages of system-level ToF solutions, and our expectations on the future development of ToF technology.

4:35 pm - 5:00 pm

Technology and Cost Review of 3D Sensing in Smartphones - Online

Taha Ayari

Technology & Cost Analyst, Compound Semiconductor at System Plus Consulting

3D Sensing has been introduced on the smartphone market a few years ago, but since late 2017 and the release of the iPhone X with Face ID a lot of companies have been investigating this space. Most of the OEM have now integrated 3D sensing, for face recognition or depth sensing. Integrating these modules is very challenging due to the limited space and the related cost. Two approaches have been considered in smartphone applications: Structured Light (SL) and Time-of-Flight (ToF). SL was developed by Apple and it is based on a complex system requiring several components, including a Global Shutter (GS) image sensor and a dot projector. The latter has been considered difficult and expensive to make due to the precision required. The ToF approach could be less complex and less expensive due to the only need of a ToF Image sensor and a flood illuminator to bring depth sensing to a system. Based on pictures extracted from physical analysis of several 3D sensing modules found in flagship smartphones from the leading OEMs, this presentation will highlight the latest technological trends for the key components and the evolutions in term of manufacturing process and package integration. A cost comparison at the module and component levels will be presented as well.

5:00 pm - 5:30 pm

Networking time

Speakers

Jianfeng Feng
3D Product Manager at Sunny Optical
Richard Liu
Imaging Market and Technology Analyst at Yole Développpement
Dr. Bernd Buxbaum
CEO and Founder at pmdtechnologies ag and Executive Board Member at ifm group of companies
Taha Ayari
Technology & Cost Analyst, Compound Semiconductor, System Plus Consulting
Xiaochi Chen
General Manager of Vertilite
Fanxiao Kong
Co-Founder and CMO of Silicon Integrated

Partners

Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy consulting, corporate finance services, reverse engineering and costing services. With a strong focus on emerging applications using silicon and/or micro manufacturing, Yole Group of Companies has expanded to include more than 80 collaborators worldwide covering Photonics – Lighting – Imaging – Sensing & Actuating – Display – RF Devices & Technologies – Compound Semiconductors & Emerging Materials – Power Electronics – Batteries & Energy Management – Semiconductor Packaging and Substrates – Semiconductor Manufacturing – Memory – Computing and Software.
Yole, along with its partners System Plus Consulting, PISEO and Blumorpho, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business. More information on www.yole.fr. Follow Yole on LinkedIn and Twitter.

www.yole.fr

CIOE (China International Optoelectronic Exposition) is the world’s largest exhibition in optoelectronic industry. It is the first as well as the most influential optoelectronic exhibition in China. The event is an annual gathering for the global optoelectronic professionals to gather around to network with business partners and discover the future trends. CIOE presents an entire optoelectronic industry chain. It is a meeting place where you could meet the people from every corner of optoelectronics fields including optical communications, lasers, semiconductors, infrared Imaging, precision optics, and photonics.

www.cioe.cn

SEMI is the global industry association representing the electronics manufacturing and design supplychain, connecting over 2,400 member companies and 1.3 million professionals worlwide.

www.semi.org

#Imaging #Lighting

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