Home > Events > 3D Sensing for Consumer Forum 2021
Technology continues to empower the 3D sensing consumer industry.
The 4th Yole Développement and CIOE forum on 3D Sensing for Consumer!
Mobile phones are experiencing turbulence, which is affecting 3D imaging and sensing. As 4G upgrades to 5G mobile, phone costs increase, affecting manufacturers’ plans to upgrade mobile phone cameras. Meanwhile the trade conflict between China and the United States has also led to a sharp decline in Huawei’s mobile phone business and to the rise of Xiaomi, a less innovative player in the context of Mobile 3D sensing.
However, these problems are only temporary and local. In 2020, Apple launched the rear-facing 3D camera with direct Time of Flight (dToF) sensing in its iPad Pro and iPhone 12 Pro. dTOF 3D cameras have innate advantages compared with indirect ToF (iToF) used in Android phones, such as digital dynamic range and response time. From a technology point of view, dTOF will undoubtedly advance the entire 3D sensing market. For the front-facing 3D camera, Apple has continued to use Structured Light and has extended it to the whole series. Android players haven’t given up on it either, as the under-screen Structured Light solution has already been demonstrated. In short, the development of technology is further increasing the capacity of the 3D sensing market. It is therefore gaining traction in other consumer electronics products, such as smart homes, vacuum robot cleaners, and smart door locks.
So please join us and participate in this
event to discuss about the bright future of 3D sensing.
Key reasons to be here!
A half-day dedicated to 3D Sensing for Consumers
6 high level presentations
Unique access to leading players and experts
Networking time onsite and an online platform to discuss with your peers
Don’t miss this opportunity to exchange with key players !
Onsite & Online Registration
Onsite Standard Rate: 195€ – Early bird rate: 160€ Early bird prices extended until August 9, 2020 This offer include onsite access to the conference, proceedings, network time, coffee break and a VIP CIOE badge(here is what is included in it).
Additional discounted rates available if you register to more than 1 forum organized by Yole Développement and CIOE :
2 Forums Onsite Standard Rate: 285€ – Early bird rate: 240€
3 Forums Onsite Standard Rate: 415€ – Early bird rate: 350€
Online rate: 90€ This offer include online access to the conference and proceedings.
2 Forums Online Rate: 130€
3 Forums Online Rate: 190€
Sponsorship opportunities
Sponsoring the 3D Sensing for Consumers Forum is a prime opportunity to put your company in front of more than 80 of the key industry players and decision makers of the industry. The forum is ameeting event in China exclusively dedicated to 3D Sensing, where you will be able to meet and talk with key players. Find more details.
The exhibition will take place at the Shenzhen World Exhibition & Convention Center, Zhancheng Road No.1, Fuhai Street, Bao’an District, Shenzhen. The Forum will take place at the 5C Conference Room, Hall 5, SWECC. To help planning your venue, find address, hotel and other details here.
Program
Sept. 17, 2021
3D Sensing for Consumer Forum 2021
Registration
Welcome & Introduction
With the arrival of dToF arrays on the iPhones, does it make 3D sensing hot again in the consumer market?
Richard LIU
Market & Technology Analyst, Imaging at Yole Développement
2020 has been a very epic year for 3D sensing with a roller-coaster of news. The first move was a positive one from Apple in following Huawei and Samsung introducing rear-facing 3D cameras on the iPad Pro and iPhone 12 Pro for AR or 3D scanning applications. However, Apple did bring a significant technology step forward by using Sony’s dToF array instead of the well-established iToF arrays the same company was supplying so far to the Android camp. In the second quarter the epidemic had spread around the world and severely affected the mobile phone industry, its sales slowed down by about 10 percent. Even worse for mobile 3D sensing, Samsung stopped using rear 3D iToF cameras in its flagship phones and downgraded it to a multipoint dToF detector. Then in the summer we learned that Huawei, the de facto market leader in mobile 3D sensing, would not be able to contribute much in the future because of US sanctions against its business. So wrapping up 2020 and having 6 month into 2021 what is the situation of the 3D sensing market?
As a first glance we can already announce that Android players didn’t give up on 3D sensing yet, they have been developing under-display cameras and in particular under-display structured light as some players already have demo phones on the table. Personal computers, tablets, and robot vacuum robot market, have all embraced 3D sensing to a certain extent, and have all benefited during the epidemic, due to stay-at-home policies. The epidemic situation, which requires for less contact, has prompted the market to develop products for non-contact interaction, which is a strong application benefit of 3D sensing, so is there more opportunity? What is the real dynamic of the 3D sensing market ? let's come to the forum and discuss.
Secure face authentication behind OLED for mobile payment
Dr. Stefan Metz
Director 3D imaging at TrinamiX
Biometric recognition methods are becoming a de-facto standard for secure authentication for protecting personal data and enabling sensitive applications like mobile payment. They offer at the same time a convenient access as well as a high recognition rate which are a must for customer acceptance. The two most integrated solutions are fingerprint and facial recognition.
The integration of biometric identification methods into our daily lives prompted criminals to develop more sophisticated methods for spoofing biometric authentication and by that hacking the device or account of the user. Only a true and spoof-proof liveness detection will prevent such fraud attempts in the future. trinamiX GmbH, a vision and sensing company and wholly owned subsidiary of the publicly traded group BASF SE, has set out to create truly secure access: to smartphones, buildings, or ATMs for unlock, but also mobile payment. The German-based company, with locations worldwide, provides a secure face authentication solution that works in real time and even behind OLED displays.
Based on their patented technology, Beam Profile Analysis, trinamiX adds an additional security layer to face authentication by classifying between different materials. The trinamiX imaging system, that consists of a standard system set up and an illumination unit, captures not only a 2D image and 3D depth information of the face in front of the device, but further differentiates between real skin and other materials. Spoofing the system with a lifelike mask, 3D sculpture or 2D printout becomes virtually impossible. trinamiX provides a solution that is convenient to use and at the same time fulfills highest security standards as for example defined by FIDO. With the ability to bring its secure solution even behind OLED displays, trinamiX also offers new flexibility in designs, which can now be more consumer friendly. With the trinamiX solution consumers will in future no longer have to worry about whether unauthorized persons will gain access to their sensitive data, the protection of their data is reliably secured.
Redefinition of IoT computer vision with 3D sensing
Dr. Fanglu Lu
Co-Founder and CSO of Deptrum Tech
In the past decade, people got to connect to the internet from anywhere through the mobile network. The number of connections has reached its upper limit due to the population size. Internet of things (IoT) are rapidly growing by connecting smart devices directly to internet, thus the number of connections are orders of magnitudes higher than the current mobile network. The internet can interact with the reality through the sensors and actuators on the IoT devices. Benefited from the breakthrough of AI technologies, computer vision is one of the major IoT perception capabilities. The conventional approaches based on 2D images demand complex algorithms and high computing power. Therefore, cloud or edge computing is needed to process the collected data. Three major constrains are raised in such architecture, which are the cost of computing and communication, the data and privacy security, and the latency and robustness. 3D sensing can capture the images with the same dimension as the real world. The information density is significantly higher than a 2D image. The AI tasks, such as recognition, localization, tracing, measurement, segmentation, can be accomplished with compact models on the IoT SoC. 3D sensing redefines the IoT computer vision by empower the perception capabilities on IoT device. Consequently, the massive and sensitive raw image data is contained in the device. It breaks aforementioned constrains on the cost, security and functions. With the continuous dropping cost and improving functionalities, 3D sensing is the key to IoT applications.
NETWORKING
Consumer Lidar Teardown and Cost Review: 3D direct ToF Lidar from Apple iPhone & iPad
Sylvain Hallereau
Principal Technology & Cost Analyst at System Plus Consulting
Following the first introduction of a 3D sensing module for Face ID in the front side of the iPhone X, Apple is now releasing the new rear lidar scanner in a first time in the iPad Pro and today in their iPhone 12.
This rear 3D sensing module is using the first ever consumer direct Time-of-Flight (dToF) CMOS Image Sensor (CIS) product with in-pixel connection. It supports Apple’s ARkit 3.5 development kit for augmented reality. The sensor from Sony, features 10 µm long pixels and a resolution of 30 kilopixels. the first time Sony has used 3D stacking for its ToF sensors.
The 3D sensing module includes also a VCSEL coming from Lumentum. The laser is designed to have multiple electrodes connected separately to the emitter array. Moreover, a new Diffractive Optical Element (DOE) from Himax is assembled on top of the VCSEL to generate a dot pattern.
Based on pictures extracted from teardown and physical analysis of Apple Lidar Module, the presentation will highlight the integration choices of Apple for their LIDAR, with the first 3D direct ToF CIS sensor from Sony and a dedicated Lumentum’s VCSEL.
New multi-Junction VCSEL with addressability enables 3D Sensing IoT Applications
Ken Huang
Product Line Director of 3D sensing at Lumentum
More efficient VCSEL array chips are well-developed now and have been broadly implemented into all kinds of consumer electronic devices. And it realizes all new smart IoT applications and makes the world in 3D, like smart device (like smartphone, robot vacuum cleaner), smart home (like door lock), smart building, smart healthcare and etc. Lumentum will introduce the whole new VCSEL array which has been upgraded from single zone design to multiple zone, single junction structure to multi-junction. With smarter control method, the depth data (or depth map) can be easily obtained and used for all kinds of application. And from the technical point of view, the power consumption and the heat dissipation will not be the issue anymore.
“Smartphones and beyond – Innovative solutions for next generation 3D sensing”
Gerald Dahlmann
DIRECTOR STRATEGIC MARKETING AT II-VI INCORPORATED
Since the launch of the iPhone X in 2017, mobile devices have been the main growth driver for 3D sensing technology. Numerous smartphones and tablets with depth sensing technology have been brought to market over the last four years. Initially, these had sensors only on the frontside for facial identification, but more recently, more and more devices have a sensor also on the backside for advanced photography and 3D scanning applications. Technology has been making great advancements along the way, but it is still in an early stage of its development and further improvements are in the works. Seamless integration into edge-to-edge touch displays, longer range with higher resolution and better power efficiency are among the challenges that are being addressed in next generation depth sensors.In parallel, new applications in wearables, augmented and virtual reality headsets have just started to emerge. Proximity sensing and eye/hand/face tracking for gesture and gaze control are among the novel use cases that pose new engineering challenges. Wearable electronics add further constraints, as far as form factor and heat dissipation are concerned. These require new solutions, and we expect these new challenges to be a driver for innovation in the coming years.II-VI is a leading and vertically integrated supplier of VCSELs to the smartphone industry and continues to be at the forefront of innovation in VCSELs, from material growth to packaged devices. Beyond this, the company offers other key technologies and platforms that will enable next generation 3D sensing solutions, such as SWIR lasers and detectors, driver ICs, meta-surface optics, as well as complete illumination modules.
TRUMPF's ViBO technology: VCSELs with integrated optics
Kevin (Yuanjie) Lu
DIRECTOR OF MARKETING AND SALES APAC AT TRUMPF PHOTONIC COMPONENTS
TRUMPF Photonic Components, a global leader in VCSEL (Vertical Cavity Surface Emitting Lasers) and Photodiode solutions for the consumer electronics, data communications, industrial sensing and heating markets, will present the new ViBO product platform. ViBO (VCSEL with integrated Backside Optics) is a revolutionary VCSEL array technology based on TRUMPF’s high-performance VCSELs with unique, patented lens forms directly etched into the GaAs-substrate. This VCSEL array technology with monolithically integrated micro-optical elements gives 3D sensing solution providers unprecedented benefits in creating tailored illumination profiles needed in advanced 3D sensing applications. It supports a new generation illumination devices that are for instance inherently eye-safe as the diffusor optics are monolithically incorporated into the laser array. Furthermore, the devices can be directly SMD mounted onto a board or driver IC without additional wire bonding. This significantly reduces the form factor over present hybrid VCSEL package solutions and supports for instance easier integration under smartphone displays.
Market & Technology Analyst, Imaging at Yole Développement
Sylvain Hallereau
Principal Technology & Cost Analyst at System Plus Consulting
Ken Huang
Product Line Director at Lumentum
Dr. Stefan Metz
Director 3D Imaging at Trinamix
Dr. Fanglu Lu
Co-Founder and CSO of Deptrum
Gerald Dahlmann
Director Strategic Marketing at II-VI Incorporated
Kevin (Yuanjie) Lu
Director of Marketing and Sales APAC at TRUMPF Photonic Components
Sponsors
photonicSENS headquartered in Valencia, Spain, delivers a unique 3D depth sensing solution that simultaneously offers a 2D image and the highest resolution depth map (1.4 Mpixels) in a single lens. Combining innovative optics and sophisticated algorithms, photonicSENS’ depth sensing solutions enable real time interaction with the real world at unprecedented levels of detail for applications such as gesture recognition, face recognition, 3D reconstruction in one shot and advanced applications such as augmented reality on smartphones, smart glasses, HMDs and more. Web: www.photonicsens.com Twitter:@photonicsens Facebook: https://www.facebook.com/photonicsens Linkedin: https://www.linkedin.com/company/photonicsens
Partners
Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy consulting, corporate finance services, reverse engineering and costing services. With a strong focus on emerging applications using silicon and/or micro manufacturing, Yole Group of Companies has expanded to include more than 80 collaborators worldwide covering Photonics – Lighting – Imaging – Sensing & Actuating – Display – RF Devices & Technologies – Compound Semiconductors & Emerging Materials – Power Electronics – Batteries & Energy Management – Semiconductor Packaging and Substrates – Semiconductor Manufacturing – Memory – Computing and Software. Yole, along with its partners System Plus Consulting, PISEO and Blumorpho, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business. Follow Yole on LinkedIn and Twitter.
CIOE (China International Optoelectronic Exposition) is the world’s largest exhibition in optoelectronic industry. It is the first as well as the most influential optoelectronic exhibition in China. The event is an annual gathering for the global optoelectronic professionals to gather around to network with business partners and discover the future trends. CIOE presents an entire optoelectronic industry chain. It is a meeting place where you could meet the people from every corner of optoelectronics fields including optical communications, lasers, semiconductors, infrared Imaging, precision optics, and photonics.
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