Yole Group of Companies invite you to join them at the 3D & Systems Summit.
The 3D & Systems Summit will address the most relevant and advanced topics related to the 3D roadmap, Heterogeneous Integration and System-In-Package manufacturing. The brand new agenda will focus on disruptive applications like Mobile IoT, High Reliability and High Performance. Invited high-caliber speakers, an exhibition area, B2B matchmaking, unique networking and business opportunities await all participants and exhibitors.
Yole Group of Companies will participate in the following:
Latest Technology Trends in Advanced Packaging for Mobile Applications
On January 27th, 2020 from 6:00PM to 6:30PM Romain Fraux, CEO at System Plus Consulting
Heterogeneous Integration : the enabler of High Performance Computing
On January 28th, 2020 from 12:45PM to 1;10PM Emilie Jolivet, Division Director, Semiconductor & Software at Yole Développement
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