Advanced Packaging & System Integration Technology Symposium – 2019

Yole Events

Shanghai, China

Advanced packaging: at the heart of innovation

Advanced packaging is driven by the wind of changes… 
Be part of our Advanced Packaging & System Integration Technology Symposium!

Please notice that the registration platform will close on Friday April 19
(6:00 PM – Shanghai Time | 12:00 PM – Paris Time | 6:00 AM – New York Time)
You will be able to register on site at the registration desk from Monday April 22!

For the 5th edition, NCAP and Yole Développement combine their expertise to build an innovative program dedicated to the advanced packaging industry – during one day and a half, meet the leading executives and gain an in-depth understanding of the market evolution!

It is a fact, Advanced packaging is at the heart of innovation. Mega-trend applications are bringing new challenges, and leading advanced packaging companies from all over the world will come to exchange ideas on their vision and future perspectives at the Advanced Packaging & System Integration Technology Symposium.

Yole Développement and NCAP have created an unprecedented program to understand the status of the advanced packaging industry and help the companies to be part of the ‘tomorrow’ industry. The Advanced Packaging & System Integration Technology Symposium is unique. Don’t miss it!

This year, the location will change, it will thus take place in Shanghai, China, from April 22PM to 23, 2019, prior to NEPCON China 2019.

During one day and a half, all packaging aspects, including Panel Level, Fan Out, System in Package, Advanced Substrates and 3D Technology, will be discussed. A focus on key applications such as AI, HPC, memory & computing, transportation (48V, EV/HEV, embedded die packaging platform, PCB, advanced substrates…), 5G and consumer (WLP and Fan-Out platforms)… will be at the heart of the conference:

AI – HPC
2.5D and 3D stacking: are these the only technologies that meet AI and data center requirements?

MEMORY & COMPUTING
Memory back-end manufacturing: who will benefit the most, and how, from the technology & business changes?

TRANSPORTATION
Infotainment, ADAS and electrification: will they reshape the automotive packaging industry as expected?

5G
How will advanced packaging solution suppliers fulfill performance requirements and complex heterogeneous integration needs?

CONSUMER
Will Fan-Out packaging continue to cannibalize and put flip-chip and advanced substrate manufacturers out of business?

New this year

During this Shanghai edition, Yole Développement’s packaging and substrate analysts invite you to get a deep understanding of the industry evolution and technology issues in semiconductor integration. With two dedicated market briefings focused on AI & HPC, memory and computing, transportation, consumer and 5G, they will describe the new ecosystem currently emerging and pushed by the needs of innovative and disruptive technologies. Yole Développement’s experts will point out the industry evolution and its consequence at each step of the supply chain.

The advanced packaging is also driven by the wind of changes, due to the impressive impact of the megatrends. Yole and NCAP China have decided to combine their expertise this year again to propose the Advanced Packaging & System Integration Technology Symposium in Shanghai, prior NEPCON China. This Shanghai edition will be the place to be to understand the industry evolution and measure the impact of the megatrends.

Emilie Jolivet

Division director, semiconductors & software

Agenda now unveiled !

The program is now avalaible (see below in the agenda section). For more information, please contact Fanny Vitrey (vitrey@yole.fr)

The structure of the symposium will allow attendees to get valuable insights into the advanced packaging industry as well as provide unprecedented opportunities for meeting with industry leaders…

Networking sessions during the all event. Get the opportunity to exchange with all the leading players in the advanced packaging industry.

Agenda

Speakers

  • Farhang Yazdani BroadPak Corporation

    Farhang Yazdani

    President & CEO - BroadPak

  • John Lee Amkor

    John Lee

    Sr. Director, Strategic Marketing Greater China Sales & Marketing - Amkor Technology

  • Dr. Dyi-Chung Hu SiPlus

    Dr. Dyi-Chung Hu

    CEO - SiPlus

  • Yaojian Lin JCET

    Yaojian Lin

    Vice President - JCET

  • David Wang SPIL

    David Wang

    Manager Product Application Engineering and Corporate R&D - SPIL

  • Dongshun Bai Brewer Science

    Dongshun Bai, Ph.D.

    Deputy Business Development Director of the Wafer-Level Packaging Materials Business Unit - Brewer Science

  • Kevin Khoo

    Marketing Director, Advanced Packaging, LS-SWIFT Division, Global Products Group – KLA Corporation

  • Chan Pin Chong

    Senior Vice President, EA/APMR & Wedge Bonders Business Units - Kulicke & Soffa

  • Yifan Guo - ASE

    Yifan Guo

    Vice President of Engineering - ASE Group

  • Lio Li

    Front-End Engineering Manager/ECP Program Manager - AT&S China

  • Tian TianCheng

    Boschman Advanced Packaging Technology

  • Rene Betschart Besi

    René Betschart

    Senior Vice President Besi Products Asia & Besi Singapore - Besi

  • Romain Fraux

    CEO - System Plus Consulting

  • Yasuhiro Morikawa

    Senior Manager of Global Market & Technology Strategy Division - ULVAC

  • Pan Zhengang UNISOC

    Dr. Pan Zhengang

    VP of New Radio Tech. - Unisoc

  • Bin Fu

    Head of Business Development and Marketing China - Bosch Sensortec

  • Min-hwa Chi Sienidm

    Min-hwa Chi

    Senior Vice President / Td - Sien (Qindao) Integated Circuit

  • Debbie Claire Sanchez

    FOWLP Equipment Product Manager - Ers Electronic Gmbh

  • Daping Yao NCAP

    Daping Yao, Ph.D.

    Technical Director - NCAP China

  • Vijay Wakharkar InvenSense

    Vijay Wakharker

    Manager Of Research & Development - Advanced Mems Packaging - TDK InvenSense

  • Zhisheng Li

    Senior Researcher in X-Vision Lab – Visionox Technology

  • Russell Liu

    VP Sales & Marketing - China WLCSP

  • Thibault Buisson

    Chief Operating Officer - Yole Développement

  • Emilie Jolivet

    Division Director Semiconductor & Software - Yole Développement

  • Santosh Kumar

    Principal Analyst And Director Packaging, Assembly & Substrates - Yole Korea

  • Favier Shoo

    Technology and Market Analyst - Yole Développement

Sponsors

PLATINUM SPONSOR

SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, CVD, and MVD® wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets. SPTS also offers Additive Printing solutions for 3D structural printing of dams and isolating layers for IC packaging and package marking. SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific.

More information: www.orbotech.com/spts

ULVAC LOGO

PLATINUM SPONSOR

ULVAC was founded in 1952 when vacuum technology was not yet widely used in Japan. It was a venture company started by young engineers who wanted to contribute to the development of science and industry through vacuum technology.

Our expertise has grown to possess many aspects of vacuum technology, including vacuum equipment, components, advanced materials, and analytical equipment.

At ULVAC, we pursue leadership in vacuum technology to realize innovations for our customers.

More information: www.ulvac-shanghai.com

besi

LUCKY DRAW SPONSOR

BE Semiconductor Industries N.V. (“Besi”) is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries focusing primarily on the advanced packaging segment of the market. Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud infrastructure, computing, automotive, industrial, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. Besi’s ordinary shares are listed on Euronext Amsterdam (symbol: BESI). Its Level 1 ADRs are listed on the OTC markets (symbol: BESIY Nasdaq International Designation) and its headquarters are located in Duiven, the Netherlands. Research and Development is organized in Switzerland, Austria and the Netherlands. Support and production are in Singapore, Malaysia and China. 

More information: www.besi.com

HANMI CI

BADGE HOLDERS SPONSOR

The best valued Company which leads the future. Our goal is to be the best valued company leading technology standard. Since HANMI Semiconductor founded the semiconductor equipment industry in 1980, we have grown steadily into a world best Middle-End Semiconductor Equipment Manufacturer & maintain the top position. Through our continued export promotion policy, our high-end technology has been shipping abroad to our more than 280 global customers and this led to more widespread appreciation of its value. Especially, Sawing & Placement System, which was designated as the “World-Class Product’ is recording the first of global market share. Hanmi TSV Dual Stacking TC Bonder has won “2017 iR52 Jang Young-Sil Award”. Hanmi provides distinguished products and services for ‘Customer Satisfaction’. Hanmi won 2016 VLSI Customer Satisfaction Survey The Best Award & 10 Best Award. Also, HANMI has been successful to get original technology with intensive R&D investment and selected as “Advanced Technology Center’ in 2008. Hanmi has 290 R&D Engineers and owns 810 worldwide Intellectual Properties. HANMI Semiconductor is trying to be the best valued company as the pioneer spirit of the first Korean semiconductor equipment manufacturer.

More information: www.hanmisemi.com 

BADGE SPONSOR

NAURA Technology Group Co., Ltd. (Hereinafter referred to as NAURA), is a leading enterprise of integrated circuit high-end technological equipment in China. It was formed through a strategic restructuring between Beijing Sevenstar Electronics Co., Ltd. (Hereinafter referred to as Sevenstar Electronics) and Beijing North Microelectronics Co., Ltd. (Hereinafter referred to as NMC). Having inherited years of high-technology research and development strength of Sevenstar Electronics and NMC, NAURA integrated its resources and complemented its advantages with a new futuristic perspective based on technological innovation. The company devotes itself to quickening its strategic transformation to become a part of the new-type manufacturing industry, becoming an international leading product service provider for high-end electronic technological equipment and precision electronic components, to improving the smart-living, and realizing China’s dream of “strengthening a country through intelligence“. NAURA owns four business groups: semiconductor equipment, vacuum equipment, new energy lithium battery equipment and precision components, which provide solutions for semiconductors, new energy resources, new materials as well as other fields. At present, NAURA owns four major industrial manufacturing bases, and its marketing service system covers major countries and regions in Europe, America and Asia. In the future, NAURA will shine in the world arena as a leading firm in high-end electronic technology equipment and precision electronics, strive for further development and lead the way for the future. Furthermore, NAURA will also stick to customer demand-oriented sustainable innovation to promote the progress of industrial technology and bring infinite possibilities for the industry.

More information: http://www.naura.com/en/ 

GIVEAWAYS & BROCHURE SPONSOR

ERS electronic GmbH, based in Germering, has been producing innovative thermal test solutions for the semiconductor industry for 50 years. Today, thermal chuck systems developed by ERS in its product families; AC3, AirCool©, AirCool© Plus and PowerSense© are an integral component in all larger-sized wafer probers right across the semiconductor industry.

More information: www.ers-gmbh.com

ks logo

GIVEAWAYS & BROCHURE SPONSOR

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices.

More information: www.kns.com

MooreElite

GIVEAWAYS & BROCHURE SPONSOR

MooreElite is a leading IC design accelerator, providing IC design services, supply chain management, talent services and enterprise services for over 1500 fabless and 500,000 semiconductor professionals. Our mission is “Make IC Design Easy & Efficient”. We are committed to providing ASIC design and Turnkey solutions, from Spec/FPGA/Algorithm to chip delivery, including chip architecture planning, IP selection, front-end design, DFT, digital verification, physical design, layout, tape out, packaging and testing services to help our customer succeed in the market. Since 2012, our team has been serving customers with knowledge of how to get the most out of silicon, offering flexible service models such as Turnkey, NRE, consulting and onsite support. Head-quartered in Shanghai, China, MooreElite has over 230 employees worldwide, with offices in Beijing, Shenzhen, Hefei, Chongqing, Suzhou, Guangzhou, Chengdu, Xi’an, Nanjing, Xiamen, Hsinchu and San Jose.

More information: www.mooreelite.com

LOGO SPONSOR

The SMT Solutions segment within the ASM Pacific Technology Group
The mission of the SMT Solutions segment within the AMS Pacific Technology Group (ASMPT) is to implement and support the smart SMT factory at electronics manufacturers worldwide.

ASM solutions such as SIPLACE placement systems and DEK printing systems support the networking, automation and optimization of central workflows with hardware, software and services that enable electronics manufacturers to transition to the smart SMT factory in stages and enjoy dramatic improvements in productivity, flexibility and quality.

Since maintaining close relationships with customers and partners is a central component of ASM’s strategy, the company has established the SMT Smart Network as a global forum for the active exchange of information between and with smart champions. In addition to being a founding member of the ADAMOS joint venture for the development of an IIoT platform for manufacturing companies, ASM is establishing together with other SMT manufacturers the open HERMES standard as a successor to the SMEMA standard for M2M communication in SMT lines.

 For more information about ASM, visit www.asm-smt.com. 

 

ASM Pacific Technology Limited
ASMPT, founded in 1975, is the only company in the world that can offer high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.

ASMPT’s Back-end Equipment Business offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, photonics, and optoelectronics industries. Its Materials Business provides customers with a variety of leadframes such as etched and stamping as well as advanced packaging materials. ASMPT SMT Solutions develops and sells best-in-class DEK printers for the SMT, semiconductor and solar markets as well as best-in-class SIPLACE SMT placement solutions.

ASMPT is listed in the Hong Kong Stock Exchange since 1989.

For more information about ASM, visit www.asmpacific.com

Bowman logo

EXHIBITOR

Bowman is a world-leading manufacturer of precision XRF coating measurement systems, with a robust local service network to support every system, at each customer location, worldwide. Our mission is to support you during every phase of your system’s lifecycle – from system evaluation, selection, and commissioning, through maintenance and modernization. Bowman service partners provide comprehensive, same-day service response for every need; we also work with customers to streamline their testing processes, and to generate the qualitative and quantitative information that’s required, in less time. Our commitment : to deliver support solutions tailored to the needs and quality culture of each individual customer, so that, with each subsequent XRF system purchase, there is no question… that the system will be a Bowman.

More information: www.bowmanxrf.comwww.applytest.com

IC COFFEE

MEDIA SPONSOR

IC CAFÉ was jointly founded by various experts from the High-Tech chains in 2012. It focuses on ICT fields, mainly in chip and hardware industry. IC CAFÉ offers various business services, such as makerspace service, investment and financing advisory. At present, IC CAFÉ has set up its companies in Nanjing, Shanghai, Beijing, Wuhan, Singapore and some other areas at home and abroad.

Among so many national makerspaces, IC CAFÉ is the organization focuses on IC industry which conferred by Ministry of Science and Technology of China, and it has realized the convergence and share of industry resources by connecting the enterprises from upstream and downstream chains of IC industry.

More information: iccafe.tuweia.cn

Wechat Subscription Number and QR Code : iccafe-sh

qr code weechat icc cafe

GSI

MEDIA SPONSOR

GSI Media was established in 2015, with the mission of building and serving the semiconductor community with most valuable industry based contents and services. GSI Media is currently one of China’s top-rated media and community brands, thanks to the high quality of contents and its long term commitment to grow the broad base of community. The business of GSI Media ranges from news reporting, market research, headhunting and finance.

Currently there are 5 Wechat public accounts under the GSI Media umbrella,GSI Media has a total of 300,000 readers from semiconductor industry, owns and manages 100+ Wechat communication group. Until today, GSI Media has influenced millions of professionals from semiconductor industry.

Semiinsights

MEDIA SPONSOR

Semiinsights is a professional independent media focused on the semiconductor industry, recognized by semiconductor professionals for its depth, professionalism and integrity, with more than 500,000 subscribers. We are one of the top ranking vertical new media in China.

More information: www.semiinsights.com

Partners

Yole Développement

POWERED BY

Founded in 1998, Yole Développement, the “More than Moore” market research & strategy consulting company has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. Yole Développement group provides market research, technology analysis, strategy consulting, targeted media, and financial advisory services. We have a global vision and customer base… The “More than Moore” company Yole and its partners System Plus Consulting, Blumorpho, PISEO and KnowMade support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business… Our fields of expertise: MEMS & Sensors – Imaging – Medical Technologies – Compound Semiconductors – RF Electronics – Solid State Lighting – Displays – Photonics – Power Electronics – Batteries & Energy Management – Advanced Packaging – Semiconductor Manufacturing – Software & Computing – Memory and more…

More information: www.yole.fr

ncap logo

HOSTED BY

As an innovation model, National Center for Advanced Packaging Co., Ltd. (NCAP China) was registered in Wuxi New District, China, in September 2012. Supported by Wuxi and Jiangsu government, National Science and Technology Major Project(02 Project) and IC Packaging and Testing Industry Chain Technology Innovation Strategic Alliance, NCAP China, a joint venture with a capital of 234.45 million, is established by ten investors, including the leaders of the IC packaging and testing industry in China (Jiangsu Changjiang Electronics Technology, TongFu Microelectronics, Huatian Technology, Shennan Circuit Company, China Wafer Level CSP, AKM Electronic Technology (Suzhou), Jiangsu CAS Internet-of-things Technology Venture Capital, Shenzhen Fastprint Circuit Tech) and CDB Capital. NCAP’s goal is to establish a national R&D center for advanced packaging and system integration, play a global leading role in the development and commercialization of advanced technologies for microelectronics packaging and system integration, and promote and sustain the technological and commercial advancement of the microelectronics industry in China.

More information: www.ncap-cn.com

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